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75220

更新时间： 2024-11-09 06:31:59
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莫仕 - MOLEX 连接器
页数 文件大小 规格书
2页 257K
描述
1.85 by 1.85mm (.073 by .073") Pitch GbX® Module-to-Backplane Connector System In 4- and 5-Pair Columns

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75220 数据手册

 浏览型号75220的Datasheet PDF文件第2页 
1.85 by 1.85mm  
(.073 by .073") Pitch  
GbX® Module-to-Backplane  
Connector System  
The GbX Backplane Interconnect System Delivers Speeds Beyond 6.0Gbps and  
High Density With Up To 69 Mated Differential Channels Per Inch  
The GbX connector system provides the speed, density, and low applied cost required by leading-edge  
backplane applications. It is especially suited for designs that require future speed upgrades by  
daughtercard replacement into an existing backplane. With a native differential signaling speed of  
6.0Gbps, the system is well suited for existing and future generations of XAUI (10 Gigabit Attachment Unit  
Interface) and InfiniBand* based systems, in addition to those based on ATCA** (Advanced Telecom  
Computing Architecture) and OIF (Optical Internetworking Forum) chip protocols.  
In 4- and 5-Pair Columns  
75220, 75360 Daughtercard  
Assemblies  
Internetworking and telecommunication equipment engineers will benefit by the GbX connector’s ability to  
provide not only a high-density, low applied-cost solution in the near term, but also by its electrical  
performance in upgradeable systems. Speeds of 10.0Gbps and beyond have been demonstrated with  
appropriate SERDES (Serializer / Deserializer) devices and board-material selection. This allows system  
architects freedom-of-design for faster future systems without the worry of backwards compatibility, along  
with the economy of a common backplane for two generations of equipment.  
75235, 75237 Backplane  
Signal Headers  
75341, 75510 Backplane  
Power  
In addition, the GbX L-Series system provides a complimentary high-density open pin field for cost-  
effective design of slower speed circuits along the same stiffener as the standard, high-speed GbX wafers.  
Features and Benefits  
■ Up to 69 real differential pairs per linear inch  
(27 real differential pairs per 10mm) provide  
higher density than VHDM-HSD®  
■ Bifurcated contact beams in daughtercard  
receptacle allow greater reliability with two  
points of contact to header pin  
■ Optimized differential pair contacts allow  
easier board trace routing  
■ Data rate options up to 10.0Gbps to support  
future daughtercard speed upgrades  
■ Modular daughtercard components with GbX  
L-Series available as custom, cost-effective  
receptacle assemblies  
SPECIFICATIONS  
Reference Information  
Packaging:  
Electrical  
Physical  
Signal/Shield Contact Current Rating: 1.0A  
Housing: Liquid Crystal Polymer, UL 94V-0  
Daughtercard Assemblies – Tube  
Headers -- Tray  
UL File No.: Pending  
CSA File No.: Pending  
Designed In: mm  
Contact to Plated-Through-Hole Resistance: 1.0 milliohm Contact: Copper Alloy  
max.  
Plating:  
Power Blade Contact Resistance: 3.0 milliohms max.  
Dielectric Withstanding Voltage: 750V RMS  
Insulation Resistance: 10,000 Megohms min.  
Contact Area – 0.76um (30µ”) Gold (Au) min.  
Solder Tail Area – Tin (Sn)  
Underplating – Nickel (Ni)  
PCB Thickness: 1.60mm (.062”) typical  
Operating Temperature: -55 to 105 degrees C  
Mechanical  
Contact Insertion Force: 44.48N (10.00 lb) typical per  
contact  
Contact Retention Force: 8.90N (2.00 lb) min. per  
contact  
Mating Force: 0.59N (0.13 lb) max. per contact  
Unmating Force: 0.29N (0.07 lb) min. per contact  
Durability: 250 cycles max.  
Notes:  
GbX and VHDM-HSD are registered trademarks of Teradyne, Inc.  
*InfiniBand is a registered trademark of the InfiniBand Trade Association  
**ATCA is a trademark of the PCI Industrial Manufacturers Group  
12

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