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74LVT32374G PDF预览

74LVT32374G

更新时间: 2024-11-24 22:56:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器
页数 文件大小 规格书
6页 80K
描述
Low Voltage 32-Bit D-Type Flip-Flop with 3-STATE Outputs

74LVT32374G 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA, BGA96,6X16,32针数:96
Reach Compliance Code:unknown风险等级:5.45
系列:LVTJESD-30 代码:R-PBGA-B96
长度:13.5 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大频率@ Nom-Sup:160000000 Hz
最大I(ol):0.064 A位数:8
功能数量:4端口数量:2
端子数量:96最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA96,6X16,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
电源:3.3 VProp。Delay @ Nom-Sup:4.5 ns
传播延迟(tpd):5.2 ns认证状态:Not Qualified
座面最大高度:1.4 mm子类别:FF/Latches
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM触发器类型:POSITIVE EDGE
宽度:5.5 mmBase Number Matches:1

74LVT32374G 数据手册

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April 2001  
Revised June 2002  
74LVT32374 74LVTH32374  
Low Voltage 32-Bit D-Type Flip-Flop  
with 3-STATE Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT32374 and LVTH32374 contain thirty-two non-  
inverting D-type flip-flops with 3-STATE outputs and are  
intended for bus oriented applications. The device is byte  
controlled. A buffered clock (CP) and Output Enable (OE)  
are common to each byte and can be shorted together for  
full 32-bit operation.  
5V VCC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH32374)  
Also available without bushold feature (74LVT32374)  
Live insertion/extraction permitted  
The LVTH32374 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Power Up/Down high impedance provides glitch-free  
bus loading  
Outputs source/sink 32 mA/+64 mA  
ESD performance:  
These flip-flops are designed for low-voltage (3.3V) VCC  
applications, but with the capability to provide a TTL inter-  
face to a 5V environment. The LVT32374 and LVTH32374  
are fabricated with an advanced BiCMOS technology to  
achieve high speed operation similar to 5V ABT while  
maintaining a low power dissipation.  
Human-body model > 2000V  
Machine model > 200V  
Charged-device model > 1000V  
Packaged in plastic Fine-Pitch Ball Grid Array (FBGA)  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LVT32374G  
(Note 1)(Note 2)  
BGA96A  
(Preliminary)  
96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
74LVTH32374G  
(Note 1)(Note 2)  
BGA96A  
Note 1: Ordering code “G” indicates Trays.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Logic Symbol  
© 2002 Fairchild Semiconductor Corporation  
DS500452  
www.fairchildsemi.com  

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