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74HC670N PDF预览

74HC670N

更新时间: 2024-02-10 12:12:55
品牌 Logo 应用领域
恩智浦 - NXP 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
9页 84K
描述
4 x 4 register file; 3-state

74HC670N 技术参数

生命周期:Obsolete包装说明:DIP,
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.41风险等级:5.59
最长访问时间:59 nsJESD-30 代码:R-PDIP-T16
内存密度:16 bit内存集成电路类型:STANDARD SRAM
内存宽度:4功能数量:1
端口数量:1端子数量:16
字数:4 words字数代码:4
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-40 °C组织:4X4
输出特性:3-STATE可输出:NO
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL认证状态:Not Qualified
最大供电电压 (Vsup):6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:AUTOMOTIVE
端子形式:THROUGH-HOLE端子位置:DUAL
Base Number Matches:1

74HC670N 数据手册

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Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
the location of the stored word. When the WE input is  
LOW, the data is entered into the addressed location. The  
addressed location remains transparent to the data while  
the WE input is LOW. Data supplied at the inputs will be  
read out in true (non-inverting) form from the 3-state  
outputs (Q0 to Q3). Dn and Wn inputs are inhibited when  
WE is HIGH.  
FEATURES  
Simultaneous and independent read and write  
operations  
Expandable to almost any word size and bit length  
Output capability: bus driver  
ICC category: MSI  
Direct acquisition of data stored in any of the four registers  
is made possible by individual read address inputs  
(RA and RB). The addressed word appears at the four  
outputs when the RE is LOW. Data outputs are in the high  
impedance OFF-state when RE is HIGH. This permits  
outputs to be tied together to increase the word capacity to  
very large numbers.  
GENERAL DESCRIPTION  
The 74HC/HCT670 are high-speed Si-gate CMOS devices  
and are pin compatible with low power Schottky TTL  
(LSTTL). They are specified in compliance with JEDEC  
standard no. 7A.  
The 74HC/HCT670 are 16-bit 3-state register files  
Design of the read enable signals for the stacked devices  
must ensure that there is no overlap in the LOW levels  
which would cause more than one output to be active at  
the same time. Parallel expansion to generate n-bit words  
is accomplished by driving the enable and address inputs  
of each device in parallel.  
organized as 4 words of 4 bits each. Separated read and  
write address inputs (RA, RB and WA, WB) and enable  
inputs (RE and WE) are available, permitting simultaneous  
writing into one word location and reading from another  
location. The 4-bit word to be stored is presented to four  
data inputs (D0 to D3). The WA and WB inputs determine  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns  
TYPICAL  
SYMBOL PARAMETER  
CONDITIONS  
UNIT  
ns  
HC  
HCT  
23  
tPHL/ tPLH propagation delay Dn to Qn  
CL = 15 pF; VCC = 5 V  
23  
CI  
input capacitance  
3.5  
3.5  
pF  
pF  
CPD  
power dissipation capacitance per package  
notes 1 and 2  
122  
124  
Notes  
1.  
C
PD is used to determine the dynamic power dissipation (PD in µW):  
2
PD = CPD × VCC2 × fi + ∑ (CL × VCC × fo)  
where:  
fi = input frequency in MHz  
fo = output frequency in MHz  
2
(CL × VCC × fo) = sum of outputs  
CL = output load capacitance in pF  
VCC = supply voltage in V  
2. For HC the condition is VI = GND to VCC  
;
for HCT the condition is VI = GND to VCC 1.5 V  
ORDERING INFORMATION  
See “74HC/HCT/HCU/HCMOS Logic Package Information”.  
December 1990  
2

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