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74CBTLV3244QG8 PDF预览

74CBTLV3244QG8

更新时间: 2024-11-30 01:10:11
品牌 Logo 应用领域
艾迪悌 - IDT PC驱动光电二极管逻辑集成电路
页数 文件大小 规格书
5页 97K
描述
LOW-VOLTAGE OCTAL BUS SWITCH

74CBTLV3244QG8 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:QSOP
包装说明:GREEN, QSOP-20针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.12
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:11129426Samacsys Pin Count:20
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Small Outline Packages
Samacsys Footprint Name:QSOP 150 MILSamacsys Released Date:2020-01-21 12:47:59
Is Samacsys:N系列:CBTLV/3B
JESD-30 代码:R-PDSO-G20JESD-609代码:e3
长度:8.65 mm逻辑集成电路类型:BUS DRIVER
湿度敏感等级:1位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP20,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:2.5/3.3 V
传播延迟(tpd):0.25 ns认证状态:Not Qualified
座面最大高度:1.75 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.635 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:3.9116 mm
Base Number Matches:1

74CBTLV3244QG8 数据手册

 浏览型号74CBTLV3244QG8的Datasheet PDF文件第2页浏览型号74CBTLV3244QG8的Datasheet PDF文件第3页浏览型号74CBTLV3244QG8的Datasheet PDF文件第4页浏览型号74CBTLV3244QG8的Datasheet PDF文件第5页 
LOW-VOLTAGE OCTAL  
BUS SWITCH  
IDT74CBTLV3244  
FEATURES:  
DESCRIPTION:  
• Pin-out compatible with standard '244 Logic products  
• 5Ω A/B bi-directional switch  
The octal bus switch has standard 244 pinouts. The CBTLV3244 is  
designed for asynchronous communication between data buses. Sets of  
four switches are controlled by one output Enable (OE). When OE is low,  
the set of four bus switches is on and port A is connected to port B. When  
OE is high, the set of four bus switches is off and a high impedance exists  
between port A and port B.  
• Isolation under power-off conditions  
• Over-voltage tolerant  
• Latch-up performance exceeds 100mA  
• VCC = 2.3V - 3.6V, Normal Range  
• ESD > 2000V per MIL-STD-883, Method 3015;  
> 200V using machine model (C = 200pF, R = 0)  
• Available in QSOP and TSSOP packages  
To ensure the high-impedance state during power up or power down,  
both OEs should be tied to VCC through a pullup resistor.  
APPLICATIONS:  
• 3.3V High Speed Bus Switching and Bus Isolation  
FUNCTIONALBLOCKDIAGRAM  
SIMPLIFIED SCHEMATIC, EACH SWITCH  
2
8
18  
SW  
1B1  
1B4  
1A1  
12  
SW  
1A4  
A
B
1
1OE  
OE  
9
11  
17  
SW  
2B1  
2B4  
2A1  
3
SW  
2A4  
19  
2OE  
TheIDTlogoisaregisteredtrademarkofIntegratedDeviceTechnology,Inc.  
INDUSTRIAL TEMPERATURE RANGE  
DECEMBER2014  
1
© 2014 Integrated Device Technology, Inc.  
DSC-5393/6  

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