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74ABT821N PDF预览

74ABT821N

更新时间: 2024-02-07 12:00:09
品牌 Logo 应用领域
恩智浦 - NXP 总线驱动器总线收发器触发器
页数 文件大小 规格书
6页 72K
描述
10-bit D-type flip-flop; positive-edge trigger 3-State

74ABT821N 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否Rohs认证:符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24针数:24
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.83Is Samacsys:N
其他特性:POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION; WITH POWER-UP RESET系列:ABT
JESD-30 代码:R-PDSO-G24JESD-609代码:e4
长度:7.8 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大频率@ Nom-Sup:125000000 Hz
最大I(ol):0.064 A湿度敏感等级:1
位数:10功能数量:1
端口数量:2端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP24,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:5 V
最大电源电流(ICC):38 mA传播延迟(tpd):6.7 ns
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:FF/Latches最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
触发器类型:POSITIVE EDGE宽度:4.4 mm
Base Number Matches:1

74ABT821N 数据手册

 浏览型号74ABT821N的Datasheet PDF文件第1页浏览型号74ABT821N的Datasheet PDF文件第2页浏览型号74ABT821N的Datasheet PDF文件第4页浏览型号74ABT821N的Datasheet PDF文件第5页浏览型号74ABT821N的Datasheet PDF文件第6页 
Philips Semiconductors  
Product specification  
10-bit D-type flip-flop; positive-edge trigger  
(3-State)  
74ABT821  
1, 2  
ABSOLUTE MAXIMUM RATINGS  
SYMBOL  
PARAMETER  
DC supply voltage  
CONDITIONS  
RATING  
–0.5 to +7.0  
–18  
UNIT  
V
V
CC  
I
IK  
DC input diode current  
V < 0  
I
mA  
V
3
V
I
DC input voltage  
–1.2 to +7.0  
–50  
I
DC output diode current  
V
O
< 0  
mA  
V
OK  
3
V
DC output voltage  
output in Off or High state  
output in Low state  
–0.5 to +5.5  
128  
OUT  
OUT  
I
DC output current  
mA  
°C  
T
stg  
Storage temperature range  
–65 to 150  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction  
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.  
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
PARAMETER  
LIMITS  
UNIT  
Min  
4.5  
0
Max  
V
DC supply voltage  
5.5  
V
V
CC  
V
Input voltage  
V
CC  
I
V
High-level input voltage  
Low-level input voltage  
High-level output current  
Low-level output current  
Input transition rise or fall rate  
2.0  
V
IH  
V
0.8  
–32  
64  
V
IL  
I
mA  
mA  
ns/V  
°C  
OH  
I
OL  
t/v  
0
10  
T
amb  
Operating free-air temperature range  
–40  
+85  
3
1995 Sep 06  

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