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74ABT821DB,112

更新时间: 2024-01-17 08:37:33
品牌 Logo 应用领域
恩智浦 - NXP 驱动信息通信管理光电二极管输出元件逻辑集成电路触发器
页数 文件大小 规格书
16页 143K
描述
74ABT821 - 10-bit D-type flip-flop; positive-edge trigger; 3-state SSOP2 24-Pin

74ABT821DB,112 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SSOP2包装说明:5.30 MM, PLASTIC, MO-150, SOT340-1, SSOP-24
针数:24Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.75
其他特性:POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION; WITH POWER-UP RESET系列:ABT
JESD-30 代码:R-PDSO-G24JESD-609代码:e4
长度:8.2 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大频率@ Nom-Sup:125000000 Hz
最大I(ol):0.064 A湿度敏感等级:1
位数:10功能数量:1
端口数量:2端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SSOP24,.3封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:5 V最大电源电流(ICC):38 mA
传播延迟(tpd):6.7 ns认证状态:Not Qualified
座面最大高度:2 mm子类别:FF/Latches
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:NICKEL PALLADIUM GOLD端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30触发器类型:POSITIVE EDGE
宽度:5.3 mmBase Number Matches:1

74ABT821DB,112 数据手册

 浏览型号74ABT821DB,112的Datasheet PDF文件第2页浏览型号74ABT821DB,112的Datasheet PDF文件第3页浏览型号74ABT821DB,112的Datasheet PDF文件第4页浏览型号74ABT821DB,112的Datasheet PDF文件第6页浏览型号74ABT821DB,112的Datasheet PDF文件第7页浏览型号74ABT821DB,112的Datasheet PDF文件第8页 
74ABT821  
NXP Semiconductors  
10-bit D-type flip-flop; positive-edge trigger; 3-state  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
0.5  
1.2  
0.5  
18  
50  
-
Max  
+7.0  
+7.0  
+5.5  
-
Unit  
V
supply voltage  
[1]  
[1]  
input voltage  
V
VO  
output voltage  
output in OFF-state or HIGH-state  
VI < 0 V  
V
IIK  
input clamping current  
output clamping current  
output current  
mA  
mA  
mA  
C  
C  
IOK  
IO  
VO < 0 V  
-
output in LOW-state  
128  
150  
+150  
[2]  
Tj  
junction temperature  
storage temperature  
-
Tstg  
65  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction  
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C.  
8. Recommended operating conditions  
Table 5.  
Symbol  
VCC  
Recommended operating conditions  
Parameter  
Conditions  
Min  
4.5  
0
Typ  
Max  
5.5  
VCC  
-
Unit  
V
supply voltage  
-
-
-
-
-
-
-
-
VI  
input voltage  
V
VIH  
HIGH-level input voltage  
LOW-level input voltage  
HIGH-level output current  
LOW-level output current  
input transition rise and fall rate  
ambient temperature  
2.0  
-
V
VIL  
0.8  
-
V
IOH  
32  
-
mA  
mA  
ns/V  
C  
IOL  
64  
5
t/V  
Tamb  
0
in free air  
40  
+85  
74ABT821  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 7 November 2011  
5 of 16  
 
 
 
 

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