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74ABT162823ADGGRE4 PDF预览

74ABT162823ADGGRE4

更新时间： 2024-01-26 06:03:15
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器触发器逻辑集成电路光电二极管输出元件信息通信管理
页数 文件大小 规格书
10页 180K
描述
18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS

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74ABT162823ADGGRE4 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：TSSOP
包装说明：TSSOP, TSSOP56,.3,20针数：56
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.77其他特性：WITH CLEAR AND CLOCK ENABLE
系列：ABTJESD-30 代码：R-PDSO-G56
长度：14 mm逻辑集成电路类型：BUS DRIVER
最大频率@ Nom-Sup：150000000 Hz最大I（ol）：0.012 A
位数：9功能数量：2
端口数量：2端子数量：56
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：3-STATE WITH SERIES RESISTOR输出极性：TRUE
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装等效代码：TSSOP56,.3,20封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：NOT SPECIFIED电源：5 V
最大电源电流（ICC）：80 mAProp。Delay @ Nom-Sup：7.5 ns
传播延迟（tpd）：7.5 ns认证状态：Not Qualified
座面最大高度：1.2 mm子类别：FF/Latches
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：4.5 V
标称供电电压 (Vsup)：5 V表面贴装：YES
技术：BICMOS温度等级：INDUSTRIAL
端子形式：GULL WING端子节距：0.5 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
触发器类型：POSITIVE EDGE宽度：6.1 mm
Base Number Matches：1

74ABT162823ADGGRE4 数据手册

 浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第4页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第5页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第6页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第8页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第9页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
PACKAGING INFORMATION  
Orderable Device  
74ABT162823ADGGRE4  
74ABT162823ADLRG4  
SN74ABT162823ADGGR  
SN74ABT162823ADL  
SN74ABT162823ADLG4  
SN74ABT162823ADLR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
DGG  
56  
56  
56  
56  
56  
56  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
TSSOP  
SSOP  
SSOP  
SSOP  
DL  
DGG  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
1...45678910

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