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74ABT162823ADGGRE4 PDF预览

74ABT162823ADGGRE4

更新时间: 2024-02-10 11:44:55
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器触发器逻辑集成电路光电二极管输出元件信息通信管理
页数 文件大小 规格书
10页 180K
描述
18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS

74ABT162823ADGGRE4 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:TSSOP, TSSOP56,.3,20针数:56
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.77其他特性:WITH CLEAR AND CLOCK ENABLE
系列:ABTJESD-30 代码:R-PDSO-G56
长度:14 mm逻辑集成电路类型:BUS DRIVER
最大频率@ Nom-Sup:150000000 Hz最大I(ol):0.012 A
位数:9功能数量:2
端口数量:2端子数量:56
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE WITH SERIES RESISTOR输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP56,.3,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
最大电源电流(ICC):80 mAProp。Delay @ Nom-Sup:7.5 ns
传播延迟(tpd):7.5 ns认证状态:Not Qualified
座面最大高度:1.2 mm子类别:FF/Latches
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE宽度:6.1 mm
Base Number Matches:1

74ABT162823ADGGRE4 数据手册

 浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第1页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第3页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第4页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第5页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第6页浏览型号74ABT162823ADGGRE4的Datasheet PDF文件第7页 
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ꢇꢊ ꢎꢅꢏ ꢆ ꢅ ꢐꢀ ꢎꢏ ꢁꢆ ꢑꢒꢓꢄꢔ ꢑ ꢓꢕ ꢏ ꢖ ꢎꢓꢕꢗ ꢖ ꢀ  
ꢘꢏ ꢆ ꢙ ꢋ ꢎꢀꢆꢄꢆ ꢑ ꢗꢐꢆ ꢖꢐ ꢆꢀ  
SCBS666B − JULY 1996 − REVISED JUNE 2004  
description/ordering information (continued)  
A buffered output-enable (OE) input places the nine outputs in either a normal logic state (high or low level) or  
a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines  
significantly. The high-impedance state and increased drive provide the capability to drive bus lines without  
interface or pullup components. OE does not affect the internal operation of the flip-flops. Old data can be  
retained or new data can be entered while the outputs are in the high-impedance state.  
The outputs, which are designed to source or sink up to 12 mA, include equivalent 25-series resistors to  
reduce overshoot and undershoot.  
These devices are fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the devices when they are powered down.  
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
To ensure the high-impedance state during power up or power down, OE shall be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
FUNCTION TABLE  
(each 9-bit flip-flop)  
INPUTS  
OUTPUT  
Q
CLR CLKEN  
OE  
L
CLK  
X
D
X
H
L
L
H
H
H
H
X
X
L
L
H
L
L
L
L
L
L
L
X
X
X
Q
0
0
L
H
X
X
Q
H
X
Z
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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