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74712-1003 PDF预览

74712-1003

更新时间: 2024-11-13 06:31:47
品牌 Logo 应用领域
莫仕 - MOLEX /
页数 文件大小 规格书
2页 280K
描述
6.25mm (.246”) Pitch Ganged RF

74712-1003 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.84
连接器类型:BOARD CONNECTOR联系完成配合:NOT SPECIFIED
触点材料:NOT SPECIFIEDBase Number Matches:1

74712-1003 数据手册

 浏览型号74712-1003的Datasheet PDF文件第2页 
            
6.25mm (.246”) Pitch  
Ganged RF  
Ganged RF System Connects High Bandwidth RF  
Signals In Blind-Mate Daughtercard Receptacles  
and Backplane Headers  
74642, 74712  
Right Angle Receptacle and  
Vertical Header  
The Ganged RF system offers customers innovative  
packaging with selectively loaded housings for  
connecting up to 2.5GHz single-ended or analog RF  
signals. The blind-mate right-angle daughtercard  
receptacles and vertical backplane headers are  
available in three- and four-port sizes with selective  
loading of high-performance vertical signal pairs. The  
press-fit terminals allow simple termination to the PCB  
with optional application tooling available from Molex.  
Options for cabling in both sizes are also available in  
several standard lengths to connect with the right-angle  
daughtercard receptacles.  
Features and Benefits  
  50 Ohm ±10% matched impedance contact system  
for low insertion loss and optimal signal integrity  
  60 db min. isolation to minimize crosstalk  
  Press-fit termination and locator pegs promote easy  
and reliable board termination  
  Modular assembly of vertical signal pairs allow  
custom loading  
  High-temperature 94V-0 housings with generous  
chamfers and blind-mating lead-ins for reliable and  
consistent mating  
  Contacts with 0.76µm (30µ”) min. gold plating on  
mating surfaces for excellent reliability  
SPECIFICATIONS  
Reference Information  
Packaging: Tray  
Physical  
Mechanical  
Housing and Insulator: 94V-0 high temperature thermoplastic Contact Insertion Force: 5.0N (1.1lb) max. per contact  
UL File No.: E107635  
CSA File No.: 152514 (LR19980)  
Designed In: mm  
Terminals and Grounds: Tin Brass  
Outer Ground Contact: Phosphor Bronze  
Plating:  
Contact Retention to Housing: 5.0N (1.1lb) min. per module  
Insertion Force to PCB: 50N (11.2lb) max. per terminal  
Durability: 500 cycles  
Terminals:  
Electrical  
Voltage: 5.0 VAC  
Current: 1.0 A max.  
0.76µm (30µ”) min. Gold in contact area  
0.88µm (35µ”) min. Tin/Lead selective  
Grounds:  
Contact Resistance: 35 milliohms max.  
Dielectric Withstanding Voltage: 1000 VAC min.  
Insulation Resistance: 1 Gigaohm min.  
Return Loss:  
0-1.0GHz: 15dB, 1.4:1 VSWR  
1.0-2.5GHz: 12dB, 1.7:1 VSWR  
Insertion Loss: 0.5dB max.  
0.88µm (35µ”) min. Tin/Lead overall  
Outer Ground Contact:  
0.76µm (30µ”) min. Gold overall  
Underplating: 1.27µm (50µ”) min. Nickel  
PCB Thickness:  
Daughtercard 3.2mm (.125”) max.  
Backplane 4.5mm (.178”) max.  
Operating Temperature: -45 to 85° C  

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