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74670-XXXX PDF预览

74670-XXXX

更新时间: 2024-11-11 06:31:47
品牌 Logo 应用领域
莫仕 - MOLEX 连接器
页数 文件大小 规格书
2页 609K
描述
2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System

74670-XXXX 数据手册

 浏览型号74670-XXXX的Datasheet PDF文件第2页 
            
2.00 by 2.25mm  
FEATURES AND SPECIFICATIONS  
(.079 by .089") Pitch  
5-Row, 6-Row and 8-Row  
VHDM-HSD  
Module-to-Backplane  
Connector System  
Features and Benefits  
  Up to 5.0 Gbps bandwidth per signal pair enables  
state-of-the-art system design and performance  
  2.00 by 2.25mm (.079 by .089”) pitch provides real  
signal density of 10 differential pairs for 5-row and  
6-row and 15 differential pairs for 8-row per  
centimeter (25 and 38 pairs respectively per inch)  
  Minimum distance between daughtercards:  
– 5-row system offers 15.00mm (.591")  
– 6-row system offers 18.00mm (.709")  
– 8-row system offers 22.00mm (.866")  
  Ground planes between signal columns provide  
tightly controlled impedance for rise times down to  
50 picoseconds (10-90%). This ensures very low  
cross talk between signals within and between  
columns  
  Ground pins are in the same grid as signal pins,  
allowing wider channels for PCB routing and traces  
up to 0.25mm (.010”) wide  
  6-row or 8-row VHDM-HSD wafers can be applied to  
®
the same stiffener as standard VHDM 6-row or 8-  
row wafers. The combination of VHDM and VHDM-  
HSD wafers, grouped together in the same stiffener,  
provides cost effective solutions to different  
performance parameters  
The Very High Density Metric High Speed Differential  
The daughtercard connector consists of a metal stiffener The backplane connectors feature headers with open  
(VHDM-HSD) connector system has been expanded to just as with the VHDM system. The system combines the ends for continuous side-to-side stacking and headers  
include 5-row, 6-row and 8-row daughtercard and  
backplane modules. VHDM-HSD is designed for  
signal wafers, power modules and guidance modules  
into one continuous connector that can be ordered as a in proper alignment of the mating daughtercard. The  
with guide pins and polarizing keys on either end to aid  
differential-pair architecture applications that require single specific part number. The card pitch of the VHDM- power modules occupy just a small width and hold  
very high interconnect density and signal integrity in a HSD 8-row system is the same as the standard VHDM 8- sequentially matable pins that each manage 10.0 amps  
single-ended configuration.  
row system, allowing both signal wafer types for single of current.  
ended and differential pair to be used together. This  
The same great modularity features and components of  
VHDM are provided in the VHDM-HSD. The 5-row and 6-  
row systems feature 2 signal pairs per column and the  
8-row system features 3 signal pairs per column in  
increments of 10 and 25 columns. All circuits are  
utilized as signal circuits without the need to use some as  
ground circuits.  
Molex offers application tooling for pressing VHDM-HSD  
modularity and design flexibility allow engineers to  
incorporate both connector systems on the same  
platforms. The system is based on a 2.00mm (.079")  
pitch and includes vertical and right angle products that  
can be configured up to 2000 circuits. The maximum  
length of a daughtercard connector on a single stiffener  
is 300mm (12").  
connectors into PCBs as separate modules or as complete  
assemblies. VHDM-HSD cable assemblies are also  
available for connecting backplane headers to high-  
performance cables.  
Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.  

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