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74651-1014 PDF预览

74651-1014

更新时间： 2024-11-11 06:31:47
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器PC
页数 文件大小 规格书
2页 609K
描述
2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System

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74651-1014 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：ObsoleteReach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8536.69.40.40
风险等级：5.84Is Samacsys：N
其他特性：POLARIZED主体宽度：0.85 inch
主体深度：0.484 inch主体/外壳类型：RECEPTACLE
连接器类型：BOARD CONNECTOR联系完成配合：NOT SPECIFIED
触点性别：MALE触点材料：NOT SPECIFIED
触点模式：RECTANGULARDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
最大插入力：.3892 N绝缘体颜色：BLACK
绝缘体材料：GLASS FILLED LIQUID CRYSTAL POLYMERMIL 符合性：NO
插接触点节距：0.079 inch匹配触点行间距：0.089 inch
混合触点：NO安装选项1：GUIDE PIN
安装选项2：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：8装载的行数：8
选件：GENERAL PURPOSEPCB接触模式：RECTANGULAR
PCB触点行间距：2.0066 mm参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子长度：0.098 inch端子节距：2 mm
端接类型：PRESS FIT触点总数：60
UL 易燃性代码：94V-0Base Number Matches：1

74651-1014 数据手册

 浏览型号74651-1014的Datasheet PDF文件第2页 
            
2.00 by 2.25mm  
FEATURES AND SPECIFICATIONS  
(.079 by .089") Pitch  
5-Row, 6-Row and 8-Row  
VHDM-HSD  
Module-to-Backplane  
Connector System  
Features and Benefits  
  Up to 5.0 Gbps bandwidth per signal pair enables  
state-of-the-art system design and performance  
™
  2.00 by 2.25mm (.079 by .089”) pitch provides real  
signal density of 10 differential pairs for 5-row and  
6-row and 15 differential pairs for 8-row per  
centimeter (25 and 38 pairs respectively per inch)  
  Minimum distance between daughtercards:  
– 5-row system offers 15.00mm (.591")  
– 6-row system offers 18.00mm (.709")  
– 8-row system offers 22.00mm (.866")  
  Ground planes between signal columns provide  
tightly controlled impedance for rise times down to  
50 picoseconds (10-90%). This ensures very low  
cross talk between signals within and between  
columns  
  Ground pins are in the same grid as signal pins,  
allowing wider channels for PCB routing and traces  
up to 0.25mm (.010”) wide  
  6-row or 8-row VHDM-HSD wafers can be applied to  
®
the same stiffener as standard VHDM 6-row or 8-  
row wafers. The combination of VHDM and VHDM-  
HSD wafers, grouped together in the same stiffener,  
provides cost effective solutions to different  
performance parameters  
The Very High Density Metric High Speed Differential  
The daughtercard connector consists of a metal stiffener The backplane connectors feature headers with open  
(VHDM-HSD) connector system has been expanded to just as with the VHDM system. The system combines the ends for continuous side-to-side stacking and headers  
include 5-row, 6-row and 8-row daughtercard and  
backplane modules. VHDM-HSD is designed for  
signal wafers, power modules and guidance modules  
into one continuous connector that can be ordered as a in proper alignment of the mating daughtercard. The  
with guide pins and polarizing keys on either end to aid  
differential-pair architecture applications that require single specific part number. The card pitch of the VHDM- power modules occupy just a small width and hold  
very high interconnect density and signal integrity in a HSD 8-row system is the same as the standard VHDM 8- sequentially matable pins that each manage 10.0 amps  
single-ended configuration.  
row system, allowing both signal wafer types for single of current.  
ended and differential pair to be used together. This  
The same great modularity features and components of  
VHDM are provided in the VHDM-HSD. The 5-row and 6-  
row systems feature 2 signal pairs per column and the  
8-row system features 3 signal pairs per column in  
increments of 10 and 25 columns. All circuits are  
utilized as signal circuits without the need to use some as  
ground circuits.  
Molex offers application tooling for pressing VHDM-HSD  
modularity and design flexibility allow engineers to  
incorporate both connector systems on the same  
platforms. The system is based on a 2.00mm (.079")  
pitch and includes vertical and right angle products that  
can be configured up to 2000 circuits. The maximum  
length of a daughtercard connector on a single stiffener  
is 300mm (12").  
connectors into PCBs as separate modules or as complete  
assemblies. VHDM-HSD cable assemblies are also  
available for connecting backplane headers to high-  
performance cables.  
Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.  
12

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