Datasheet > 745X101183FP

745X101183FP

更新时间： 2024-11-13 03:00:55

品牌	Logo	应用领域
西迪斯 - CTS		/
页数	文件大小	规格书
5页	156K
描述
Chip Resistor Arrays

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745X101183FP 数据手册

Chip Resistor Arrays

TechnicalData

Features

• Low Cost

• Thick Film Technology

• High Density Packaging

• Leadless Surface Mount Construction

• Tape and Reel Packaging

• Solder Coated Nickel Barrier Pads

• Isolated and Bussed Circuits

• Concave and Convex Terminations

• RoHS Compliant

Product Benefits

• High Density Packaging

Up to 30% less space per resistor than 0603 chip resistors

Up to 75% less space per resistor than 0805 chip resistors

• Placement Efficiency

Networks require fewer placements than discrete components

Larger overall size eases handling compared to discrete components

• Low Profile; Can be used in PCMCIA cards

Electrical and Mechanical Specifications

Maximum

Operating

Voltage

PCB Area (in²)

Per Resistor

Resistance

Range, Ohms

70°C Power

Per Resistor*

Series

Circuit Type

740

741

742

743

744

745

746

0.0008

0.0015

0.0037

0.0071

0.0094

0.0058

0.0013

Isolated

Bussed

10 - 1M

33 - 470K

33 - 100K

.031W

.063W

.100W

.125W

.063W

.031W

12.5V

25V

50V

100V

200V

50V

25V

*Total Rated Package Power equals total number of resistors times rated Power Per Resistor

Resistance Tolerance

Standard: ±5% or .5Ω (whichever is greater)

Operating Temperature Range -55°C to +125°C

Temperature Coefficient

Standard: 200PPM/°C

Page 1 of 5

February 2008

CTS Electronic Components

www.ctscorp.com

12 3 4 5

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