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71V65802S100PF8 PDF预览

71V65802S100PF8

更新时间: 2024-12-02 10:42:07
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
26页 489K
描述
TQFP-100, Reel

71V65802S100PF8 数据手册

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256K x 36, 512K x 18  
IDT71V65602/Z  
IDT71V65802/Z  
3.3VSynchronousZBTSRAMs  
2.5V I/O, Burst Counter  
PipelinedOutputs  
Features  
AddressandcontrolsignalsareappliedtotheSRAMduringoneclock  
cycle,andtwocycleslatertheassociateddatacycleoccurs,beitreadorwrite.  
The IDT71V65602/5802 contain data I/O, address and control signal  
registers.Outputenableistheonlyasynchronoussignalandcanbeusedto  
disabletheoutputsatanygiventime.  
A Clock Enable (CEN) pin allows operation of the IDT71V65602/5802  
tobesuspendedaslongasnecessary.Allsynchronousinputsareignored  
when(CEN)ishighandtheinternaldeviceregisterswillholdtheirprevious  
values.  
256K x 36, 512K x 18 memory configurations  
Supports high performance system speed - 150MHz  
(3.8ns Clock-to-Data Access)  
ZBTTM Feature - No dead cycles between write and read cycles  
Internally synchronized output buffer enable eliminates the  
need to control OE  
Single R/W (READ/WRITE) control pin  
Positive clock-edge triggered address, data, and control  
There are three chip enable pins (CE1, CE2, CE2) that allow the  
user to deselect the device when desired. If any one of these three are not  
asserted when ADV/LDis low, no new memory operation can be initiated.  
However,anypendingdatatransfers(readsorwrites)willbecompleted.The  
databuswilltri-statetwocyclesafterchipisdeselectedorawriteisinitiated.  
The IDT71V65602/5802 have an on-chip burst counter. In the burst  
mode, the IDT71V65602/5802 can provide four cycles of data for a single  
addresspresentedtotheSRAM.Theorderoftheburstsequenceisdefined  
bytheLBOinputpin.TheLBOpinselectsbetweenlinearandinterleavedburst  
sequence.TheADV/LDsignalisusedtoloadanewexternaladdress(ADV/  
LD=LOW) orincrementtheinternalburstcounter(ADV/LD=HIGH).  
The IDT71V65602/5802 SRAM utilize IDT's latest high-performance  
signal registers for fully pipelined applications  
4-word burst capability (interleaved or linear)  
Individual byte write (BW1 - BW4) control (May tie active)  
Three chip enables for simple depth expansion  
3.3V power supply (±5%)  
2.5V I/O Supply (VDDQ)  
Power down controlled by ZZ input  
Packaged in a JEDEC standard 100-pin plastic thin quad and  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch  
ball grid array (fBGA)  
Description  
The IDT71V65602/5802 are 3.3V high-speed 9,437,184-bit CMOSprocess,andarepackagedinaJEDECStandard14mmx20mm100-  
(9Megabit)synchronousSRAMs.Theyaredesignedtoeliminatedead  
bus cycles when turning the bus around between reads and writes, or  
writesandreads. Thus, theyhavebeengiventhenameZBTTM, orZero  
Bus Turnaround.  
pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA)  
and a 165 fine pitch ball grid array (fBGA).  
PinDescriptionSummary  
A
0
-A18  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enables  
CE  
1, CE  
2
, CE  
2
Output Enable  
OE  
R/W  
Read/Write Signal  
Clock Enable  
CEN  
Individual Byte Write Selects  
Clock  
BW  
1, BW  
2
, BW  
3
, BW  
4
CLK  
ADV/LD  
Advance burst address / Load new address  
Linear / Interleaved Burst Order  
Sleep Mode  
Synchronous  
Static  
LBO  
ZZ  
Asynchronous  
Synchronous  
Static  
I/O  
0-I/O31, I/OP1-I/OP4  
Data Input / Output  
Core Power, I/O Power  
Ground  
V
V
DD, VDDQ  
SS  
Supply  
Supply  
Static  
5303 tbl 01  
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.  
FEBRUARY 2009  
1
©2007IntegratedDeviceTechnology,Inc.  
DSC-5303/06  

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