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71V2546SA133BGI8 PDF预览

71V2546SA133BGI8

更新时间: 2024-11-16 14:33:43
品牌 Logo 应用领域
艾迪悌 - IDT 时钟静态存储器内存集成电路
页数 文件大小 规格书
28页 496K
描述
ZBT SRAM, 128KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119

71V2546SA133BGI8 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:BGA包装说明:14 X 22 MM, PLASTIC, MS-028AA, BGA-119
针数:119Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.75Is Samacsys:N
最长访问时间:4.2 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:4718592 bit
内存集成电路类型:ZBT SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:119字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:-40 °C
组织:128KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA119,7X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.5,3.3 V
认证状态:Not Qualified座面最大高度:2.36 mm
最大待机电流:0.045 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.31 mA
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Lead (Sn63Pb37)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

71V2546SA133BGI8 数据手册

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IDT71V2546S/XS  
IDT71V2548S/XS  
128K x 36, 256K x 18  
3.3V Synchronous ZBT™ SRAMs  
IDT71V2546SA/XSA  
IDT71V2548SA/XSA  
2.5V I/O, Burst Counter  
Pipelined Outputs  
Features  
AddressandcontrolsignalsareappliedtotheSRAMduringoneclock  
cycle, andtwocycleslatertheassociateddatacycleoccurs, beitread  
or write.  
128K x 36, 256K x 18 memory configurations  
Supports high performance system speed - 150 MHz  
(3.8 ns Clock-to-Data Access)  
The IDT71V2546/48 contain data I/O, address and control signal  
registers.Outputenableistheonlyasynchronoussignalandcanbeused  
todisabletheoutputsatanygiventime.  
AClockEnable(CEN)pinallowsoperationoftheIDT71V2546/48to  
besuspendedaslongasnecessary.Allsynchronousinputsareignored  
when(CEN)ishighandtheinternaldeviceregisterswillholdtheirprevious  
values.  
ZBTTM Feature - No dead cycles between write and read  
cycles  
Internally synchronized output buffer enable eliminates the  
need to control OE  
Single R/W (READ/WRITE) control pin  
Positive clock-edge triggered address, data, and control  
signal registers for fully pipelined applications  
4-word burst capability (interleaved or linear)  
Individual byte write (BW1 - BW4) control (May tie active)  
Three chip enables for simple depth expansion  
3.3V power supply (±5%), 2.5V I/O Supply (VDDQ)  
Optional Boundary Scan JTAG Interface (IEEE1149.1  
Therearethreechipenablepins(CE1,CE2,CE2)thatallowtheuser  
to deselect the device when desired. If any one of these three are not  
assertedwhenADV/LDislow,nonewmemoryoperationcanbeinitiated.  
However,anypendingdatatransfers(readsorwrites)willbecompleted.  
Thedatabuswilltri-statetwocyclesafterchipisdeselectedorawriteis  
initiated.  
complaint)  
TheIDT71V2546/48hasanon-chipburstcounter.Intheburstmode,  
theIDT71V2546/48canprovidefourcyclesofdataforasingleaddress  
presentedtotheSRAM.Theorderoftheburstsequenceisdefinedbythe  
LBOinputpin.TheLBOpinselectsbetweenlinearandinterleavedburst  
sequence. The ADV/LD signal is used to load a new external address  
(ADV/LD = LOW) or increment the internal burst counter (ADV/LD =  
HIGH).  
The IDT71V2546/48 SRAMs utilize IDT's latest high-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pinthinplasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and 165 fine pitch ball grid array (fBGA).  
Packaged in a JEDEC standard 100-pin plastic thin quad  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine  
pitch ball grid array  
Description  
TheIDT71V2546/48 are3.3Vhigh-speed4,718,592-bit(4.5Mega-  
bit)synchronousSRAMS.Theyaredesignedtoeliminatedeadbuscycles  
when turning the bus around between reads and writes, or writes and  
reads. Thus, they have been given the name ZBTTM, or Zero Bus  
Turnaround.  
PinDescriptionSummary  
A
0-A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enables  
CE1, CE  
2
, CE  
2
Output Enable  
OE  
R/W  
Read/Write Signal  
Clock Enable  
CEN  
Individual Byte Write Selects  
Clock  
BW  
1
, BW  
2
, BW  
3
, BW  
4
CLK  
ADV/LD  
LBO  
TMS  
TDI  
Advance burst address / Load new address  
Linear / Interleaved Burst Order  
Test Mode Select  
Test Data Input  
Synchronous  
Static  
Synchronous  
Synchronous  
N/A  
TCK  
TDO  
TRST  
ZZ  
Test Clock  
Test Data Output  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Static  
JTAG Reset (Optional)  
Sleep Mode  
I/O  
0
-I/O31, I/OP1-I/OP4  
Data Input / Output  
Core Power, I/O Power  
Ground  
V
V
DD, VDDQ  
SS  
Supply  
Supply  
Static  
5294 tbl 01  
FEBRUARY 2007  
1
©2007IntegratedDeviceTechnology,Inc.  
DSC-5294/05  

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