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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 714-100-13JJ-LJ-B | COOPER |
获取价格 |
IC Socket, PGA100, 100 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 714-100-13MM-LJ-B | COOPER |
获取价格 |
IC Socket, PGA100, 100 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 714-100-13MM-LK-B | COOPER |
获取价格 |
PGA SOCKET,100 CONTACTS,13X13,0.1 ROW SPACING,PC TAIL W/RETNN TERMINAL |
|
| 714-101-13E-SM-D | COOPER |
获取价格 |
IC Socket, PGA101, 101 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Surface Mount |
|
| 714-101-13F-LJ-D | COOPER |
获取价格 |
IC Socket, PGA101, 101 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 714-101-13F-LJ-S | COOPER |
获取价格 |
IC Socket, PGA101, 101 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 714-101-13F-LST-L | COOPER |
获取价格 |
IC Socket, PGA101, 101 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 714-101-13Z-LB-S | COOPER |
获取价格 |
IC Socket, PGA101, 101 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Wire Wrap |
|
| 7141-05-1000 | ETC |
获取价格 |
|
|
| 7141-05-1001 | ETC |
获取价格 |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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意法半导体发布第四代SiC技术，助力电动汽车电驱
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