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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 709-299-20B-LC-B | COOPER |
获取价格 |
IC Socket, PGA299, 299 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 709-299-20B-LC-L | COOPER |
获取价格 |
IC Socket, PGA299, 299 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 709-299-20B-LS-S | COOPER |
获取价格 |
IC Socket, PGA299, 299 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 709-299-20B-SM-L | COOPER |
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PGA SOCKET,299 CONTACTS,20X20,0.1 ROW SPACING,SURFACE MOUNT TERMINAL |
|
| 7093 | NXP |
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MAGNETRON FOR USE AS PULSED OSCILLATOR |
|
| 7093.2510 | SCHURTER |
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Shock-Safe Fuseholder, 10.3 x 38 mm, Fingergrip |
|
| 7093.2540 | SCHURTER |
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Shock-Safe Fuseholder, 10.3 x 38 mm, Fingergrip |
|
| 709-300-20A-LB-B | COOPER |
获取价格 |
PGA SOCKET,300 CONTACTS,20X20,0.1 ROW SPACING,WRAP POST TERMINAL |
|
| 709-300-20A-LC-D | COOPER |
获取价格 |
IC Socket, PGA300, 300 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 7093-0174 | AMPHENOL |
获取价格 |
SMPM (SIZE 12) D38999 PIN CONTACT TO SMA MALE |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
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