Datasheet > 70287-1161

70287-1161

更新时间： 2024-10-29 06:31:15

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
5页	307K
描述
2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 32 Circuits, 8.13mm (.320") Mating Pin Length, 0.38μm (15μ") Gold (Au) Selective

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

70287-1161 数据手册

This document was generated on 03/31/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0702871148

Active

Description:

2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with Retention

Pin, 6 Circuits, 8.13mm (.320") Mating Pin Length, 0.38µm (15µ") Gold (Au) Selective

Plating

Documents:

3D Model

Product Specification PS-70280 (PDF)

Packaging Specification (PDF)

Drawing (PDF)

RoHS Certificate of Compliance (PDF)

Series

image - Reference only

Agency Certification

CSA

EU RoHS

ELV and RoHS

Compliant

China RoHS

LR19980

E29179

General

Product Family

Series

Application

Product Name

REACH SVHC

Not Reviewed

Halogen-Free

Status

PCB Headers

70287

Board-to-Board, Wire-to-Board

C-Grid®

Not Reviewed

Need more information on product

environmental compliance?

Physical

Breakaway

Yes

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Circuits (Loaded)

Circuits (maximum)

Color - Resin

Black

Durability (mating cycles max)

First Mate / Last Break

Flammability

94V-0

Please visit the Contact Us section for any

non-product compliance questions.

Glow-Wire Compliant

Guide to Mating Part

Keying to Mating Part

Lock to Mating Part

N/A

None

Search Parts in this Series

70287Series

Material - Metal

Brass

Material - Plating Mating

Material - Plating Termination

Material - Resin

Gold

Tin

Mates With

7859 Shunt, C-Grid Receptacles, SL™

Crimp, FFC and IDT Housing

High Temperature Thermoplastic

Number of Rows

Orientation

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

Vertical

0.125 In

3.18 mm

PCB Retention

None

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.062 In

1.57 mm

Bag

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Pitch - Term. Interface (in)

Pitch - Term. Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to Mating Part

Polarized to PCB

0.100 In

2.54 mm

0.100 In

2.54 mm

15.200

0.38

80.000

2.00

12 3 4 5

中文翻译

下载PDF

与70287-1161相关器件

型号	品牌	获取价格	描述	数据表
70287-1162	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 34
70287-1163	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa
70287-1164	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa
70287-1165	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa
70287-1166	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa
70287-1167	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa
70287-1168	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 46
70287-1169	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa
70287-1170	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa
70287-1171	MOLEX	获取价格	2.54mm (.100") Pitch C-Grid® Header, Breakawa

与70287-1161相关文章

三星深化印度制造布局，供应链本地化进程加速
2024-10-29

14
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

16
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
2024-10-18

40
意法半导体发布第四代SiC技术，助力电动汽车电驱
2024-10-15

47

产品中心

服务支持

精选活动

关于我们

帮助中心

70287-1161

70287-1161 数据手册

与70287-1161相关器件

与70287-1161相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

70287-1161

70287-1161 数据手册

与70287-1161相关器件

与70287-1161相关文章

您还可以找

您在本页遇到什么问题？