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61084-101 PDF预览

61084-101

更新时间: 2024-10-28 22:06:51
品牌 Logo 应用领域
MII 晶体晶体管开关
页数 文件大小 规格书
2页 85K
描述
SURFACE MOUNT (NPN) GENERAL PURPOSE TRANSISTOR

61084-101 数据手册

 浏览型号61084-101的Datasheet PDF文件第2页 
61084  
SURFACE MOUNT (NPN)  
GENERAL PURPOSE TRANSISTOR  
(2N2222AUA)  
Mii  
OPTOELECTRONIC PRODUCTS  
DIVISION  
Features:  
Applications  
Hermetically sealed  
Analog switches  
Miniature package to minimize circuit board area  
Ceramic surface mount package  
Signal conditioning  
Small signal amplifiers  
High density packaging  
MIL-PRF-19500 screening available  
DESCRIPTION  
The 61084 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic  
package is ideal for designs where board space and device weight are important requirements. This device is available  
custom binned to customer specifications or screened to MIL-PRF-19500.  
ABSOLUTE MAXIMUM RATINGS  
Collector-Base Voltage...........................................................................................................................................................75V  
Collector-Emitter Voltage........................................................................................................................................................50V  
Emitter-Collector Voltage..........................................................................................................................................................6V  
Continuous Collector Current ............................................................................................................................................800mA  
Power Dissipation (Derate at the rate of 3.33 mW/°C above 25°C) ...............................................................................500mW  
Maximum Junction Temperature...................................................................................................................................... +200°C  
Operating Temperature (See part selection guide for actual operating temperature) ......................................-65°C to +200°C  
Storage Temperature......................................................................................................................................... -65°C to +200°C  
Lead Soldering Temperature (vapor phase reflow for 30 seconds) ................................................................................. 215°C  
Package Dimensions  
Schematic Diagram  
1
0.225 [5.72]  
0.215 [5.46]  
C
0.075 [1.91]  
0.061 [1.55]  
0.155 [1.40]  
0.145 [3.68]  
PIN 1  
IDENTIFIER  
0.048 [1.22]  
2 0.032 [0.81]  
3 PL  
0.028 [0.17]  
0.022 [0.56]  
1
4
0.055 [1.40]  
0.045 [1.14]  
3
0.088 [2.24]  
0.072 [1.83]  
E
B
2
3
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION 725 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 487-6918  
www.micropac.com E-MAIL: optosales@micropac.com  
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