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5962F9674202QXC PDF预览

5962F9674202QXC

更新时间: 2024-02-18 20:41:17
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
29页 234K
描述
8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, ROHS COMPLIANT, HERMETIC SEALED, FLATPACK-16

5962F9674202QXC 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:DFP包装说明:DFP, FL16,.3
针数:16Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.15
Is Samacsys:N模拟集成电路 - 其他类型:SINGLE-ENDED MULTIPLEXER
JESD-30 代码:R-CDFP-F16JESD-609代码:e4
标称负供电电压 (Vsup):-15 V信道数量:8
功能数量:1端子数量:16
最大通态电阻 (Ron):1800 Ω最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DFP封装等效代码:FL16,.3
封装形状:RECTANGULAR封装形式:FLATPACK
峰值回流温度(摄氏度):NOT SPECIFIED电源:+-15 V
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class Q
座面最大高度:2.92 mm子类别:Multiplexer or Switches
最大供电电流 (Isup):2 mA标称供电电压 (Vsup):15 V
表面贴装:YES最长接通时间:3000 ns
切换:BREAK-BEFORE-MAKE技术:CMOS
温度等级:MILITARY端子面层:Gold (Au)
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
总剂量:300k Rad(Si) V宽度:6.73 mm
Base Number Matches:1

5962F9674202QXC 数据手册

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APPENDIX A  
APPENDIX A FORMS A PART OF SMD 5962-96742  
Device type 02  
Die physical dimensions.  
Die size: 3050 x 2360 microns  
Die thickness: 19 1 mils  
Interface materials.  
Top metallization: Al/Si/Cu 16.0 kÅ 2 kÅ  
Backside metallization: None.  
Glassivation.  
Type: PSG  
Thickness: 8 kÅ 1 kÅ  
Substrate: Dielectrically Isolated (DI)  
Assembly related information.  
Substrate potential: Insulator  
Special assembly instructions: None  
FIGURE A-2. Die bonding pad locations and electrical functions - continued.  
SIZE  
STANDARD  
5962-96742  
A
MICROCIRCUIT DRAWING  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
SHEET  
E
27  
DSCC FORM 2234  
APR 97  

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