生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, CGA560,33X33,50 | 针数: | 560 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.37 |
Is Samacsys: | N | JESD-30 代码: | S-CBGA-B560 |
JESD-609代码: | e0 | 长度: | 42.5 mm |
等效关口数量: | 1124022 | 输入次数: | 404 |
逻辑单元数量: | 27648 | 输出次数: | 404 |
端子数量: | 560 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 1124022 GATES |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装等效代码: | CGA560,33X33,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 电源: | 1.2/3.6,2.5 V |
可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY | 认证状态: | Not Qualified |
筛选级别: | MIL-PRF-38535 Class Q | 座面最大高度: | 5.35 mm |
子类别: | Field Programmable Gate Arrays | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 宽度: | 42.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
5962-9957401QXB | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957401QXC | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957401QYA | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957401QYB | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957401QYC | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957401QZA | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957401QZB | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957401QZC | XILINX |
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QPro Virtex 2.5V QML High-Reliability FPGAs | |
5962-9957501NTC | XILINX |
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Field Programmable Gate Array, 3136 CLBs, 55000 Gates, 200MHz, CMOS, PQFP240, PLASTIC, QFP | |
5962-9957501NUA | WEDC |
获取价格 |
IC FPGA, 3136 CLBS, 55000 GATES, 200 MHz, PBGA432, 40 X 40 MM, PLASTIC, MO-151BAU, BGA-432 |