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5962-9758501QRA PDF预览

5962-9758501QRA

更新时间: 2024-01-07 21:21:23
品牌 Logo 应用领域
德州仪器 - TI 驱动器逻辑集成电路输出元件
页数 文件大小 规格书
18页 1049K
描述
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

5962-9758501QRA 技术参数

生命周期:Active零件包装代码:DFP
包装说明:DFP, FL20,.3针数:20
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.17控制类型:ENABLE LOW
计数方向:UNIDIRECTIONAL系列:F/FAST
JESD-30 代码:R-GDFP-F20长度:13.09 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.064 A位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:INVERTED封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DFP封装等效代码:FL20,.3
封装形状:RECTANGULAR封装形式:FLATPACK
包装方法:TUBE峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V最大电源电流(ICC):75 mA
Prop。Delay @ Nom-Sup:9 ns传播延迟(tpd):9 ns
认证状态:Qualified筛选级别:MIL-PRF-38535 Class Q
座面最大高度:2.45 mm子类别:Bus Driver/Transceiver
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:TTL温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6.92 mmBase Number Matches:1

5962-9758501QRA 数据手册

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PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54F240, SN74F240 :  
Catalog: SN74F240  
Military: SN54F240  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  

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