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5962-8867201EA PDF预览

5962-8867201EA

更新时间: 2024-10-28 05:05:39
品牌 Logo 应用领域
德州仪器 - TI 逻辑集成电路
页数 文件大小 规格书
18页 639K
描述
High-Speed CMOS Logic 4-Bit Magnitude Comparator

5962-8867201EA 技术参数

生命周期:Active零件包装代码:DIP
包装说明:DIP, DIP16,.3针数:16
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
Factory Lead Time:6 weeks风险等级:5.18
其他特性:CASCADABLE, THREE POSSIBLE OUTPUTS ARE A<B, A=B AND A>B系列:HCT
JESD-30 代码:R-GDIP-T16长度:19.56 mm
负载电容(CL):50 pF逻辑集成电路类型:MAGNITUDE COMPARATOR
最大I(ol):0.004 A位数:4
功能数量:1端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
输出极性:TRUE封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP16,.3
封装形状:RECTANGULAR封装形式:IN-LINE
包装方法:TUBE峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V最大电源电流(ICC):0.08 mA
Prop。Delay @ Nom-Sup:50 ns传播延迟(tpd):60 ns
认证状态:Qualified筛选级别:MIL-STD-883
座面最大高度:5.08 mm子类别:Arithmetic Circuit
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6.92 mmBase Number Matches:1

5962-8867201EA 数据手册

 浏览型号5962-8867201EA的Datasheet PDF文件第6页浏览型号5962-8867201EA的Datasheet PDF文件第7页浏览型号5962-8867201EA的Datasheet PDF文件第8页浏览型号5962-8867201EA的Datasheet PDF文件第10页浏览型号5962-8867201EA的Datasheet PDF文件第11页浏览型号5962-8867201EA的Datasheet PDF文件第12页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Oct-2007  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
CD74HCT85E  
CD74HCT85EE4  
CD74HCT85M  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
N
N
D
D
D
D
D
D
D
D
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
Pb-Free  
(RoHS)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HCT85M96  
CD74HCT85M96E4  
CD74HCT85M96G4  
CD74HCT85ME4  
CD74HCT85MG4  
CD74HCT85MT  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HCT85MTE4  
CD74HCT85MTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  

5962-8867201EA 替代型号

型号 品牌 替代类型 描述 数据表
CD74HC85PWR TI

完全替代

High-Speed CMOS Logic 4-Bit Magnitude Comparator
CD74HC85PW TI

完全替代

High-Speed CMOS Logic 4-Bit Magnitude Comparator
CD74HCT85E TI

完全替代

High Speed CMOS Logic 4-Bit Magnitude Comparator

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