5秒后页面跳转
捷配首页

Datasheet > 5962-8755201XC
5962-8755201XC PDF预览

5962-8755201XC

更新时间： 2024-02-27 11:21:33
品牌 Logo 应用领域
其他 - ETC 驱动器逻辑集成电路
页数 文件大小 规格书
19页 87K
描述
Buffer/Driver

阅读下载

获取价格

5962-8755201XC 技术参数

生命周期：Obsolete包装说明：DFP,
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.82Is Samacsys：N
系列：ACJESD-30 代码：R-GDFP-F20
JESD-609代码：e4长度：12.955 mm
逻辑集成电路类型：BUS DRIVER位数：4
功能数量：2端口数量：2
端子数量：20最高工作温度：125 °C
最低工作温度：-55 °C输出特性：3-STATE
输出极性：TRUE封装主体材料：CERAMIC, GLASS-SEALED
封装代码：DFP封装形状：RECTANGULAR
封装形式：FLATPACK传播延迟（tpd）：12.5 ns
认证状态：Not Qualified筛选级别：MIL-STD-883
座面最大高度：2.16 mm最大供电电压 (Vsup)：6 V
最小供电电压 (Vsup)：2 V标称供电电压 (Vsup)：3 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：GOLD
端子形式：FLAT端子节距：1.27 mm
端子位置：DUAL宽度：7.115 mm
Base Number Matches：1

5962-8755201XC 数据手册

 浏览型号5962-8755201XC的Datasheet PDF文件第3页浏览型号5962-8755201XC的Datasheet PDF文件第4页浏览型号5962-8755201XC的Datasheet PDF文件第5页浏览型号5962-8755201XC的Datasheet PDF文件第7页浏览型号5962-8755201XC的Datasheet PDF文件第8页浏览型号5962-8755201XC的Datasheet PDF文件第9页 
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the  
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made  
available onshore at the option of the reviewer.  
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in  
microcircuit group number 36 (see MIL-PRF-38535, appendix A).  
4. QUALITY ASSURANCE PROVISIONS  
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with  
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan  
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in  
accordance with MIL-PRF-38535, appendix A.  
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted  
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in  
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.  
4.2.1 Additional criteria for device class M.  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision  
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall  
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified  
in test method 1015.  
(2) TA = +125°C, minimum.  
b. Interim and final electrical test parameters shall be as specified in table II herein.  
4.2.2 Additional criteria for device classes Q and V.  
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the  
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained  
under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance  
with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit  
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified  
in test method 1015 of MIL-STD-883.  
b. Interim and final electrical test parameters shall be as specified in table II herein.  
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in  
MIL-PRF-38535, appendix B.  
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in  
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups  
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).  
SIZE  
STANDARD  
5962-87552  
A
MICROCIRCUIT DRAWING  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
E
SHEET  
6
DSCC FORM 2234  
APR 97  
1...3456789...19

下载PDF

与5962-8755201XC相关器件

型号 品牌 描述 获取价格 数据表
5962-8755201ZX WEDC Bus Driver, AC Series, 2-Func, 4-Bit, True Output, CMOS, CDSO20, GULLWING, CERAMIC, FP-20

获取价格
5962-87552023A ETC Dual 4-Bit Non-Inverting Buffer/Driver

获取价格
5962-8755202JA ETC Dual 4-Bit Non-Inverting Buffer/Driver

获取价格
5962-8755202KA ETC Dual 4-Bit Non-Inverting Buffer/Driver

获取价格
5962-8755202LA ETC Dual 4-Bit Non-Inverting Buffer/Driver

获取价格
5962-87553012A WEDC Decoder/Driver, ACT Series, Inverted Output, CMOS, CQCC20

获取价格

与5962-8755201XC相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证