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5962-8755201XC PDF预览

5962-8755201XC

更新时间: 2024-02-21 01:57:57
品牌 Logo 应用领域
其他 - ETC 驱动器逻辑集成电路
页数 文件大小 规格书
19页 87K
描述
Buffer/Driver

5962-8755201XC 技术参数

生命周期:Obsolete包装说明:DFP,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.82Is Samacsys:N
系列:ACJESD-30 代码:R-GDFP-F20
JESD-609代码:e4长度:12.955 mm
逻辑集成电路类型:BUS DRIVER位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK传播延迟(tpd):12.5 ns
认证状态:Not Qualified筛选级别:MIL-STD-883
座面最大高度:2.16 mm最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:GOLD
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL宽度:7.115 mm
Base Number Matches:1

5962-8755201XC 数据手册

 浏览型号5962-8755201XC的Datasheet PDF文件第1页浏览型号5962-8755201XC的Datasheet PDF文件第2页浏览型号5962-8755201XC的Datasheet PDF文件第4页浏览型号5962-8755201XC的Datasheet PDF文件第5页浏览型号5962-8755201XC的Datasheet PDF文件第6页浏览型号5962-8755201XC的Datasheet PDF文件第7页 
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
J
GDIP1-T24 or CDIP2-T24  
GDFP2-F24 or CDFP3-F24  
GDIP3-T24 or CDIP4-T24  
GDIP1-T20 or CDIP2-T20  
GDFP2-F20 or CDFP3-F20  
see figure 1  
GDFP1-G20  
CQCC1-N20  
CQCC1-N28  
24  
24  
24  
20  
20  
20  
20  
20  
28  
Dual-in-line  
Flat pack  
Dual-in-line  
Dual-in-line  
Flat pack  
Flat pack  
Flat pack  
Square leadless chip carrier  
Square leadless chip carrier  
K
L
R
S
X
Z
2
3
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,  
appendix A for device class M.  
1.3 Absolute maximum ratings. 1/, 2/, 3/  
Supply voltage range (VCC).............................................................................. -0.5 V dc to +7.0 V dc  
DC input voltage range (VIN)............................................................................ -0.5 V dc to VCC + 0.5 V dc  
DC output voltage range (VOUT) ....................................................................... -0.5 V dc to VCC + 0.5 V dc  
Clamp diode current (IIK, IOK)........................................................................... ±20 mA  
DC output current (per output pin).................................................................. ±50 mA  
DC VCC or GND current (per output pin) ......................................................... ±25 mA 4/  
Maximum power dissipation (PD).................................................................... 500 mW  
Storage temperature range (TSTG).................................................................... -65°C to +150°C  
Lead temperature (soldering, 10 seconds)....................................................... +245°C  
Thermal resistance, junction-to-case (qJC)....................................................... See MIL-STD-1835  
Junction temperature (TJ)................................................................................ +175°C 5/  
1.4 Recommended operating conditions. 2/, 3/, 6/  
Supply voltage range (VCC).............................................................................. +2.0 V dc to +6.0 V dc  
Input voltage range (VIN) ................................................................................. +0.0 V dc to VCC  
Output voltage range (VOUT) ............................................................................ +0.0 V dc to VCC  
Case operating temperature range (TC) ........................................................... -55°C to +125°C  
Input rise or fall times (tr, tf):  
Device type 01;  
VCC = 3.6 V and 5.5 V................................................................................ 0 to 8 ns/V  
Device type 02;  
Data VCC = 3.6 V and 5.5 V ....................................................................... 0 to 10 ns/V  
mOE VCC = 3.6 V and 5.5 V...................................................................... 0 to 5 ns/V  
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the  
maximum levels may degrade performance and affect reliability.  
2/ Unless otherwise noted, all voltages are referenced to GND.  
3/ The limits for the parameters specified herein shall apply over the full specified VCC range and case temperature range  
of -55°C to +125°C.  
4/ For devices with multiple VCC or GND pins, this value represents the total VCC or GND current.  
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in  
accordance with method 5004 of MIL-STD-883.  
6/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data  
retention implies no input transition and no stored data loss with the following conditions: VIH ³ 70% VCC, VIL £ 30% VCC  
,
VOH ³ 70% VCC @ -20mA, VOL £ 30% VCC @ 20 mA.  
SIZE  
STANDARD  
5962-87552  
A
MICROCIRCUIT DRAWING  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
G
SHEET  
3
DSCC FORM 2234  
APR 97  

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