1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
J
GDIP1-T24 or CDIP2-T24
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
GDIP1-T20 or CDIP2-T20
GDFP2-F20 or CDFP3-F20
see figure 1
GDFP1-G20
CQCC1-N20
CQCC1-N28
24
24
24
20
20
20
20
20
28
Dual-in-line
Flat pack
Dual-in-line
Dual-in-line
Flat pack
Flat pack
Flat pack
Square leadless chip carrier
Square leadless chip carrier
K
L
R
S
X
Z
2
3
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/, 2/, 3/
Supply voltage range (VCC).............................................................................. -0.5 V dc to +7.0 V dc
DC input voltage range (VIN)............................................................................ -0.5 V dc to VCC + 0.5 V dc
DC output voltage range (VOUT) ....................................................................... -0.5 V dc to VCC + 0.5 V dc
Clamp diode current (IIK, IOK)........................................................................... ±20 mA
DC output current (per output pin).................................................................. ±50 mA
DC VCC or GND current (per output pin) ......................................................... ±25 mA 4/
Maximum power dissipation (PD).................................................................... 500 mW
Storage temperature range (TSTG).................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds)....................................................... +245°C
Thermal resistance, junction-to-case (qJC)....................................................... See MIL-STD-1835
Junction temperature (TJ)................................................................................ +175°C 5/
1.4 Recommended operating conditions. 2/, 3/, 6/
Supply voltage range (VCC).............................................................................. +2.0 V dc to +6.0 V dc
Input voltage range (VIN) ................................................................................. +0.0 V dc to VCC
Output voltage range (VOUT) ............................................................................ +0.0 V dc to VCC
Case operating temperature range (TC) ........................................................... -55°C to +125°C
Input rise or fall times (tr, tf):
Device type 01;
VCC = 3.6 V and 5.5 V................................................................................ 0 to 8 ns/V
Device type 02;
Data VCC = 3.6 V and 5.5 V ....................................................................... 0 to 10 ns/V
mOE VCC = 3.6 V and 5.5 V...................................................................... 0 to 5 ns/V
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Unless otherwise noted, all voltages are referenced to GND.
3/ The limits for the parameters specified herein shall apply over the full specified VCC range and case temperature range
of -55°C to +125°C.
4/ For devices with multiple VCC or GND pins, this value represents the total VCC or GND current.
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
6/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data
retention implies no input transition and no stored data loss with the following conditions: VIH ³ 70% VCC, VIL £ 30% VCC
,
VOH ³ 70% VCC @ -20mA, VOL £ 30% VCC @ 20 mA.
SIZE
STANDARD
5962-87552
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
G
SHEET
3
DSCC FORM 2234
APR 97