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5962-3826701M7Q

更新时间： 2024-01-16 14:06:54
品牌 Logo 应用领域
麦斯威 - MAXWELL 存储可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
40页 315K
描述
MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K x 8 BIT EEPROM, MONOLITHIC SILICON

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5962-3826701M7Q 数据手册

 浏览型号5962-3826701M7Q的Datasheet PDF文件第32页浏览型号5962-3826701M7Q的Datasheet PDF文件第33页浏览型号5962-3826701M7Q的Datasheet PDF文件第34页浏览型号5962-3826701M7Q的Datasheet PDF文件第36页浏览型号5962-3826701M7Q的Datasheet PDF文件第37页浏览型号5962-3826701M7Q的Datasheet PDF文件第38页 
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured  
(see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-PRF-38535.  
a. End-point electrical parameters shall be as specified in table IIA herein.  
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified  
in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation  
hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes  
must meet the postirradiation end-point electrical parameter limits as defined in table IA at T = +25 C ±5 C, after  
A
exposure, to the subgroups specified in table IIA herein.  
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.  
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate figures and tables as follows.  
4.5.1 Erasing procedures. The erasing procedures shall be as specified by the device manufacturer and shall be available upon  
request.  
4.5.2 Programming procedure. The programming procedures shall be as specified by the device manufacturer and shall be made  
available upon request.  
4.5.3 Software data protect procedures. The software data protect procedures shall be as specified by the device manufacturer  
and shall be made available upon request.  
4.6 Delta measurements for device classes Q and V. Delta measurements, as specified in table IIA, shall be made and recorded  
before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical parameters  
to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option, either perform delta  
measurements or within 24 hours after burn-in perform final electrical parameter tests, subgroups 1, 7, and 9.  
5. PACKAGING  
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes  
Q and V or MIL-PRF-38535, appendix A for device class M.  
6. NOTES  
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original  
equipment), design applications, and logistics purposes.  
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared  
specification or drawing.  
6.1.2 Substitutability. Device class Q devices will replace device class M devices.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-38267  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
G
SHEET  
35  
DSCC FORM 2234  
APR 97  
1...32333435363738...40

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 		MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K x 8 BIT EEPROM, MONOLITHIC SILICON
5962-3826701MTQ MAXWELL

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 		MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K x 8 BIT EEPROM, MONOLITHIC SILICON

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