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5962-0924001VXC PDF预览

5962-0924001VXC

更新时间: 2024-01-13 04:31:19
品牌 Logo 应用领域
德州仪器 - TI 转换器模数转换器
页数 文件大小 规格书
46页 1034K
描述
12-Bit, 1-GSPS Analog-to-Digital Converter

5962-0924001VXC 技术参数

生命周期:Active零件包装代码:QFP
包装说明:QFP-100针数:100
Reach Compliance Code:not_compliantECCN代码:3A001.A.2.C
HTS代码:8542.39.00.01风险等级:5.44
Is Samacsys:N最小模拟输入电压:-2 V
转换器类型:ADC, PROPRIETARY METHODJESD-30 代码:S-CQFP-F100
长度:19.05 mm最大线性误差 (EL):0.1099%
模拟输入通道数量:1位数:12
功能数量:1端子数量:100
最高工作温度:125 °C最低工作温度:-55 °C
输出位码:OFFSET BINARY, 2'S COMPLEMENT BINARY输出格式:PARALLEL, WORD
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:HGQFF
封装等效代码:TPAK100,2.0SQ,20封装形状:SQUARE
封装形式:FLATPACK, HEAT SINK/SLUG, GUARD RING峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3,5 V认证状态:Qualified
采样速率:1000 MHz采样并保持/跟踪并保持:TRACK
筛选级别:MIL-STD-883 Class V座面最大高度:3.15 mm
子类别:Analog to Digital Converters最大压摆率:255 mA
标称供电电压:3.3 V表面贴装:YES
技术:BIPOLAR温度等级:MILITARY
端子形式:FLAT端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:19.05 mmBase Number Matches:1

5962-0924001VXC 数据手册

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PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
5962-0924001VXC  
ACTIVE  
CFP  
HFS  
100  
1
TBD  
Call TI  
Call TI  
-55 to 125  
(5962- ~  
ADS5400MHFSV)  
0924001VXC  
ADS5400MHFS-V  
ADS5400HFS/EM  
ADS5400MHFSV  
PREVIEW  
ACTIVE  
CFP  
CFP  
HFS  
HFS  
100  
100  
TBD  
TBD  
AU  
N / A for Pkg Type  
Call TI  
25 Only  
ADS5400HFS/EM  
EVAL ONLY  
1
Call TI  
-55 to 125  
(5962- ~  
ADS5400MHFSV)  
0924001VXC  
ADS5400MHFS-V  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Addendum-Page 1  

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