Datasheet > 55755-0319

55755-0319

更新时间： 2024-11-07 06:30:03

品牌	Logo	应用领域
莫仕 - MOLEX		插座
页数	文件大小	规格书
5页	169K
描述
Universal Serial Bus, Shielded I/O, Type B Receptacle, Vertical, 4 Circuits, 0.76μm30μ

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

55755-0319 数据手册

This document was generated on 04/07/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0557550319

Active

Description:

2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, with

Inner Positive Lock, 3 Circuits, Lead-free

Documents:

3D Model

Drawing (PDF)

Product Specification PS-51216-007 (PDF)

RoHS Certificate of Compliance (PDF)

Series

General

Product Family

Series

Application

Product Name

image - Reference only

China RoHS

ELV and RoHS

Compliant

PCB Headers

55755

Wire-to-Board

N/A

EU RoHS

Physical

REACH SVHC

Not Reviewed

Halogen-Free

Status

Breakaway

Circuits (Loaded)

Circuits (maximum)

Not Reviewed

Need more information on product

environmental compliance?

Color - Resin

Natural

Durability (mating cycles max)

First Mate / Last Break

Glow-Wire Compliant

Guide to Mating Part

Keying to Mating Part

Lock to Mating Part

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

None

Yes

Mated Height (in)

Mated Height (mm)

Material - Metal

Material - Plating Mating

Material - Plating Termination

Material - Resin

Number of Rows

Orientation

0.530 In

13.45 mm

Brass

Tin

Nylon

Vertical

0.130 In

3.30 mm

Yes

Please visit the Contact Us section for any

non-product compliance questions.

Search Parts in this Series

55755Series

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

Mates With

51216 Wire-to-Board and Wire-to-Wire

Receptacle Housing

PCB Retention

Yes

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.062 In

1.60 mm

Tray

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to Mating Part

Shrouded

0.079 In

2.00 mm

1.00

Yes

Fully

Stackable

Surface Mount Compatible (SMC)

Temperature Range - Operating

Termination Interface: Style

-25°C to +85°C

Through Hole

Electrical

Current - Maximum per Contact

2.5A

12 3 4 5

中文翻译

下载PDF

与55755-0319相关器件

型号	品牌	获取价格	描述	数据表
55755-0410	MOLEX	获取价格	Board Connector, 4 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal
557550419	MOLEX	获取价格	2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, withInner P
55755-0419	MOLEX	获取价格	2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, withInner P
55755-0519	MOLEX	获取价格	2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, withInner P
55755-0719	MOLEX	获取价格	2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, withInner P
55755-0810	MOLEX	获取价格	Board Connector, 8 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal
55755-0819	MOLEX	获取价格	2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, with Inner
55755-101	AMPHENOL	获取价格	Board Stacking Connector, 240 Contact(s), 8 Row(s), Female, Straight, Surface Mount Termin
557551019	MOLEX	获取价格	Board Connector, 10 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Solder Termina
55755-1019	MOLEX	获取价格	2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, withInner P

与55755-0319相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

19
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

16
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

39
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

37

产品中心

服务支持

精选活动

关于我们

帮助中心

55755-0319

55755-0319 数据手册

与55755-0319相关器件

与55755-0319相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

55755-0319

55755-0319 数据手册

与55755-0319相关器件

与55755-0319相关文章

您还可以找

您在本页遇到什么问题？