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55715-101LF PDF预览

55715-101LF

更新时间: 2024-09-25 19:01:51
品牌 Logo 应用领域
安费诺 - AMPHENOL 连接器
页数 文件大小 规格书
6页 253K
描述
Board Stacking Connector, 81 Contact(s), 9 Row(s), Female, Straight, Surface Mount Terminal, Receptacle, ROHS COMPLIANT

55715-101LF 数据手册

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boarD to boarD connEctors  
MEG-ARRAY® MEZZANINE CONNECTOR SYSTEM  
HiGH DEnsity, bGa DEsiGn EXcEls at HiGH spEED pErForMancE anD rEliability  
DEscription  
®
The MEG-Array Mezzanine Connector  
system provides the high density and high  
speed benefits of a large array supported by  
the reliability and low costs of standard surface  
mount PCB assembly.  
1.27mm x 1.27mm array of discrete circuit  
contacts allows flexible ground distribution to  
optimize high speed signal integrity at speeds  
exceeding 10 Gb/s. MEG-Array is offered in a  
variety of PCB mezzanine stack heights.  
FCIs advanced manufacturing supports a  
patented BGA interconnect design. Multiple  
in-process vision systems monitor BGA contact  
integrity including solder sphere size, location  
and co-planarity plus other critical-to-function  
attributes.  
tarGEt MarkEts /  
applications  
FEaturEs & bEnEFits  
High density, high speed, discrete contact, array connector  
Flexible ground distribution optimizes high speed signal integrity  
10 Gb/s differential pair performance with under 1% cross-talk  
28 Gb/s high speed performance documented for 4mm and 6mm  
stack height  
COMMUNICATIONS  
Transmission  
Access  
Switching  
Online s-parameter files and signal integrity performance reports  
improve design accuracy and time-to-market  
Optics  
1.27mm x 1.27mm grid provides 71 contacts per cm2 density to  
save space  
Networking  
DATA  
Wide range of sizes and PCB stack heights increase mechanical  
design flexibility  
Servers  
Storage  
6 PCB Stack heights: 4mm to 14mm  
8 sizes: 81 to 528 positions  
I & I  
Revolutionary, trusted BGA interconnect platform  
High density standard BGA attachment lowers assembly costs by  
using standard SMT processes  
Industrial controls & equipment  
Analytical & diagnostic  
Medical  
BGA natural surface tension provides self-alignment and self-leveling  
for multiple connector usage  
Patented BGA contact attachment preserves solder ball positioning  
Optimized PCB routing enhances electrical performance  
Quality and Reliability  
Time-tested reliability record includes Telcordia GR-1217-CORE and  
NPS-25298-2 options  
22+ year solder joint reliability per IPC-SM-785  
17 Billion + lines shipped to customer satisfaction  
Precious metal plating options satisfy varying customer needs for  
environmental resistance  

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