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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 5525BP15B0750 | JOHANSON |
获取价格 |
Integrated Passive Component Packaging |
|
| 5-525D | HAMMOND |
获取价格 |
DATA SUBJECT TO CHANGE WITHOUT NOTLCE |
|
| 5526 | MOLEX |
获取价格 |
MAX-LOC Strain Relief Cord-Sealing Grip, 1/2" NPT, Straight Female, Cable Diameter |
|
| 5526010200F | DIALIGHT |
获取价格 |
Single Color LED |
|
| 55260162452 | SUMIDA |
获取价格 |
General Purpose Inductor, 0.002uH, 10%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, RO |
|
| 55260163452 | SUMIDA |
获取价格 |
General Purpose Inductor, 0.002uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROH |
|
| 55260182452 | SUMIDA |
获取价格 |
General Purpose Inductor, 0.002uH, 10%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, RO |
|
| 55260183452 | SUMIDA |
获取价格 |
General Purpose Inductor, 0.002uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROH |
|
| 552-6020-200 | DIALIGHT |
获取价格 |
Single Color LED Array, Green, Diffused, T1-1/2, 4mm |
|
| 5526020200F | DIALIGHT |
获取价格 |
Single Color LED |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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