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54F241FMQB PDF预览

54F241FMQB

更新时间: 2024-11-07 21:05:51
品牌 Logo 应用领域
美国国家半导体 - NSC 驱动输出元件逻辑集成电路
页数 文件大小 规格书
10页 188K
描述
IC F/FAST SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver

54F241FMQB 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:QFF, FL20,.3Reach Compliance Code:unknown
ECCN代码:3A001.A.2.CHTS代码:8542.39.00.01
风险等级:5.27其他特性:OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION
控制类型:ENABLE LOW/HIGH系列:F/FAST
JESD-30 代码:R-GDFP-F20JESD-609代码:e0
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.048 A位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:CERAMIC, GLASS-SEALED
封装代码:QFF封装等效代码:FL20,.3
封装形状:RECTANGULAR封装形式:FLATPACK
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
最大电源电流(ICC):90 mAProp。Delay @ Nom-Sup:7 ns
传播延迟(tpd):7 ns认证状态:Not Qualified
筛选级别:38535Q/M;38534H;883B座面最大高度:2.286 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:TTL
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:FLAT端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.73 mmBase Number Matches:1

54F241FMQB 数据手册

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May 1995  
54F/74F240 54F/74F241 54F/74F244  
#
#
Octal Buffers/Line Drivers with TRI-STATE Outputs  
É
General Description  
Features  
Y
TRI-STATE outputs drive bus lines or buffer memory  
address registers  
The ’F240, ’F241 and ’F244 are octal buffers and line driv-  
ers designed to be employed as memory and address driv-  
ers, clock drivers and bus-oriented transmitters/receivers  
which provide improved PC and board density.  
Y
Y
Y
Y
Outputs sink 64 mA (48 mA mil)  
12 mA source current  
Input clamp diodes limit high-speed termination effects  
Guaranteed 4000V minimum ESD protection  
Package  
Number  
Commercial  
74F240PC  
Military  
Package Description  
N20A  
J20A  
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F240DM (Note 2)  
20-Lead Ceramic Dual-In-Line  
74F240SC (Note 1)  
74F240SJ (Note 1)  
M20B  
M20D  
W20A  
E20A  
N20A  
J20A  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
54F240FM (Note 2)  
54F240LM (Note 2)  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
74F241PC  
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F241DM (Note 2)  
20-Lead Ceramic Dual-In-Line  
74F241SC (Note 1)  
74F241SJ (Note 1)  
M20B  
M20D  
W20A  
E20A  
N20A  
J20A  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
54F241FM (Note 2)  
54F241LM (Note 2)  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
74F244PC  
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F244DM (Note 2)  
20-Lead Ceramic Dual-In-Line  
74F244SC (Note 1)  
74F244SJ (Note 1)  
74F244MSA (Note 1)  
M20B  
M20D  
MSA20  
W20A  
E20A  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
20-Lead Molded Shrink Small Outline, EIAJ Type II  
54F244FM (Note 2)  
54F244LM (Note 2)  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
e
Note 1: Devices also available in 13 reel. Use Suffix  
SCX, SJX and MSAX.  
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix  
e
DMQB, FMQB and LMQB.  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/9501  
RRD-B30M75/Printed in U. S. A.  

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