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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 53779-0290 | MOLEX |
获取价格 |
1.25 WIRE TO BOARD CONN. WAFER ASSY FOR S.M.T. |
|
| 53779-0310 | MOLEX |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Right Angle, Surface Mount Terminal, |
|
| 53779-0370 | MOLEX |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Surface Moun |
|
| 53779-0390 | MOLEX |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Surface Moun |
|
| 53779-0510 | MOLEX |
获取价格 |
Board Connector, 5 Contact(s), 1 Row(s), Male, Right Angle, Surface Mount Terminal, |
|
| 53779-0519 | MOLEX |
获取价格 |
Board Connector, 5 Contact(s), 1 Row(s), Male, Right Angle, Surface Mount Terminal, LEAD F |
|
| 53779-0610 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Right Angle, Surface Mount Terminal, |
|
| 53779-0690 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Surface Moun |
|
| 53779-0710 | MOLEX |
获取价格 |
Board Connector, 7 Contact(s), 1 Row(s), Male, Right Angle, Surface Mount Terminal |
|
| 53779-0719 | MOLEX |
获取价格 |
Board Connector, 7 Contact(s), 1 Row(s), Male, Right Angle, Surface Mount Terminal, LEAD F |
|
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
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