5秒后页面跳转
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 53375-0888 | MOLEX |
获取价格 |
Board Connector, 8 Contact(s), 1 Row(s), Male, Straight, 0.098 inch Pitch, Solder Kinked L |
|
| 53375-0889 | MOLEX |
获取价格 |
Board Connector, 8 Contact(s), 1 Row(s), Male, Straight, 0.098 inch Pitch, Solder Kinked L |
|
| 53375-0890 | MOLEX |
获取价格 |
2.50mm (.098") Pitch Mini-Lock™ Wire-to-Board |
|
| 53375-0910 | MOLEX |
获取价格 |
2.50mm (.098") Pitch Mini-Lock™ Wire-to-Board |
|
| 53375-0910 | MOLEXKITS |
获取价格 |
Fully Shrouded Positive Lock Vertical and Right Angle Header and Receptacle |
|
| 53375-0913 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, LEAD FREE |
|
| 53375-0922 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.098 inch Pitch, Solder Kinked L |
|
| 53375-0981 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.098 inch Pitch, Solder Kinked L |
|
| 53375-0986 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.098 inch Pitch, Solder Kinked L |
|
| 53375-0987 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Male, Straight, 0.098 inch Pitch, Solder Kinked L |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
工作时间：9:00-21:00
CEO邮箱：ceo@jiepei.com
投诉邮箱：tousu@jiepei.com
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
