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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 533609-60 | ETC |
获取价格 |
DAEMPFUNGSLIED BECA DM100 |
|
| 533621B02552G | AAVID |
获取价格 |
Channel style heat sink with folded back fins |
|
| 533621B22552G | AAVID |
获取价格 |
Heat Sink, Extruded, Radial, Aluminum, Anodized |
|
| 533622B02552G | AAVID |
获取价格 |
Channel style heat sink with folded back fins |
|
| 53364-1029 | MOLEX |
获取价格 |
Board Stacking Connector, 10 Contact(s), 2 Row(s), Female, Straight, 0.031 inch Pitch, Sur |
|
| 53364-1070 | MOLEX |
获取价格 |
Board Stacking Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.031 inch Pitch, Surfa |
|
| 53364-1219 | MOLEX |
获取价格 |
Board Connector, 12 Contact(s), 2 Row(s), Male, Straight, 0.031 inch Pitch, Surface Mount |
|
| 53364-1229 | MOLEX |
获取价格 |
Board Stacking Connector, 12 Contact(s), 2 Row(s), Female, Straight, 0.031 inch Pitch, Sur |
|
| 53364-1271 | MOLEX |
获取价格 |
Board Stacking Connector, 12 Contact(s), 2 Row(s), Female, Straight, Surface Mount Termina |
|
| 53364-1291 | MOLEX |
获取价格 |
Board Stacking Connector, 12 Contact(s), 2 Row(s), Male, Straight, 0.031 inch Pitch, Surfa |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
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