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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 52968-0619 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 2 Row(s), Receptacle, LEAD FREE |
|
| 52968-0819 | MOLEX |
获取价格 |
Board Connector, 8 Contact(s), 2 Row(s), 0.079 inch Pitch, Locking, Black Insulator, Recep |
|
| 5297 | POMONA |
获取价格 |
BNC M/F With DC-Blocking Series Capacitor |
|
| 529701B02100G | AAVID |
获取价格 |
Heat Sink, 5.5ohm, Extruded, Radial, Aluminum, Anodized, ROHS COMPLIANT |
|
| 529701B02500G | AAVID |
获取价格 |
How to Use This Catalog |
|
| 529702B02500G | AAVID |
获取价格 |
Channel style heat sink with folded back fins |
|
| 52975-0610 | MOLEX |
获取价格 |
Card Edge Connector, 6 Contact(s), 1 Row(s), Female, Right Angle, Surface Mount Terminal |
|
| 52975-0663 | MOLEX |
获取价格 |
Card Edge Connector, 6 Contact(s), 1 Row(s), Right Angle, 0.02 inch Pitch, Surface Mount T |
|
| 52975-0683 | MOLEX |
获取价格 |
Card Edge Connector, 6 Contact(s), 1 Row(s), Female, Right Angle, 0.02 inch Pitch, Surface |
|
| 52975-0745 | MOLEX |
获取价格 |
Card Edge Connector, 7 Contact(s), 1 Row(s), Right Angle, 0.02 inch Pitch, Surface Mount T |
|
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
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