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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 503159-1217 | MOLEX |
获取价格 |
Board Connector |
|
| 5031591300 | MOLEX |
获取价格 |
1.50mm (.059") Pitch CLIK-Mate™ Wire-to-Board |
|
| 503159-1300 | MOLEX |
获取价格 |
1.50mm (.059") Pitch CLIK-Mate™ Wire-to-Board |
|
| 5031591310 | MOLEX |
获取价格 |
1.50mm (.059") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Through Hole |
|
| 503159-1310 | MOLEX |
获取价格 |
1.50mm (.059") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Through Hole |
|
| 503159-1312 | MOLEX |
获取价格 |
Board Connector |
|
| 503159-1316 | MOLEX |
获取价格 |
Board Connector |
|
| 5031591400 | MOLEX |
获取价格 |
1.50mm (.059") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row,Through Hole |
|
| 503159-1400 | MOLEX |
获取价格 |
1.50mm (.059") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row,Through Hole |
|
| 5031591410 | MOLEX |
获取价格 |
1.50mm (.059") Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Through Hole, Ver |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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