AMPMODU Interconnection System
AMPMODU System 50 Connectors
(Page 52)
(Page 44)
(Page 38)
(Page 40)
(Page 39)
(Page 31)
(Page 45)
(Page 29)
Double Row, .025
(Page 33)
(Page 50)
Ribbon Cable
Mount Receptacle
(Page 56)
(Page 34)
3
(Page 30)
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(Page 50)
The AMPMODU System 50
connector family includes a
wide variety of high density
board-to-board (thru-hole
and surface-mount) and
cable-to-board connectors.
AMPMODU System 50 is
composed of one- and two-
row receptacles and post
headers on .050 x .100
[1.27 x 2.54] spacing
Board-mounted thru-hole
post headers and
receptacle connectors are
available for right-angle
and vertical mating
mating headers (thru-hole or
surface-mount). Ribbon
cable connectors mass
terminate 30 AWG [0.05
mm2] solid and 32 AWG
[0.03 mm2] stranded, .025
[0.64] centerline ribbon
cable with PVC or Teflon®
insulation.
■
Recognized under the
Component Program of
Underwriters
R
Laboratories Inc.
File No. E28476
configurations. Surface-
mounted connectors are
available in vertical, double
row styles for parallel
■ Certified by
Canadian Standards
Association*,
File No. LR 7189
R
stacking applications.
*CSA certification pending on certain products,
as noted.
Connectors for mass
Shrouded post headers
provide polarization to
mating cable receptacles
and aid alignment of mating
connectors. Unshrouded
headers allow close
termination to FFC cable or
flexible etched circuitry
have dual beam contacts;
options include shielded
cable and solder tabs. Both
types of cable connectors
are available as component
parts and as completed
assemblies.
between contacts for
Dimensioning:
extreme density and
efficient use of printed
circuit board area.
Dimensions are in inches and millimeters.
Values in brackets are metric equivalents. Metric
symbols used are:
mm (millimeter)
cm (centimeter)
m (meter)
AMPMODU System 50
receptacles and header
assemblies can be
categorized in three groups:
board-mount headers,
board-mount receptacles
and cable-to-board
receptacles. Receptacle
contacts and mating .015
[0.38] square posts are
formed from high
conductivity copper alloy
and are selectively plated
with gold to promote higher
performance and reliability.
mm2 (square millimeter)
C (Celsius)
stacking of daughter cards.
Vertical stacking connectors
space parallel mated
N (newton)
kg (kilogram)
boards as shown in the
illustration on page 63.
Housings on all board-
mount assemblies are made
of high temperature tolerant
materials and incorporate
stand-offs for free drainage
of flux cleaning solutions.
■ Produced under a
Quality Management
System certified
to ISO 9001
The variety of components
and application possibilities,
combined with small size
and outstanding quality,
make AMPMODU
System 50 suitable for high
density systems.
A copy of the
certificate is available
upon request.
Cable-to-board connectors
have integral latches for
positive locking to shrouded
Teflon® is a trademark of E.I. du Pont de
Nemours and Company.
25
Catalog 1307819
Revised 8-08
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
millimeters unless otherwise
reference purposes only.
Specifications subject
to change.
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
specified. Values in brackets
are metric equivalents.
www.tycoelectronics.com
UK: 44-8706-080-208
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