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45971-9161 PDF预览

45971-9161

更新时间： 2024-11-03 06:28:11
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器
页数 文件大小 规格书
2页 191K
描述
1.27 by 1.27mm (.050 by .050”) Pitch SEARAY* Connector

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中文翻译

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45971-9161 技术参数

是否Rohs认证： 符合生命周期：Obsolete
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8536.69.40.40风险等级：5.64
Is Samacsys：N其他特性：LOW PROFILE
主体/外壳类型：RECEPTACLE连接器类型：BOARD STACKING CONNECTOR
联系完成配合：NOT SPECIFIED触点性别：FEMALE
触点材料：NOT SPECIFIEDDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
MIL 符合性：NO插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD装载的行数：6
选件：GENERAL PURPOSE端子节距：1.27 mm
端接类型：SOLDER触点总数：270
UL 易燃性代码：94V-0Base Number Matches：1

45971-9161 数据手册

 浏览型号45971-9161的Datasheet PDF文件第2页 
1.27 by 1.27mm  
FEATURES AND SPECIFICATIONS  
(.050 by .050”) Pitch  
SEARAY* Connector  
The SEARAY connector accommodates low-profile applications with stack heights of 7.00 to  
15.00mm (.276 to .591”) for the large and growing, high-density, high-performance mezzanine  
connector market  
45970 Plug  
45971 Receptacle  
The SEARAY board-to-board connector is designed for  
applications with high pin-count devices or memory  
modules that are mounted on mezzanine or module  
PCBs. The unique, Molex-patented, solder-charge  
technology results in better process yields and a lower-  
applied cost versus equivalent Ball Grid Array (BGA)  
connector products. Solder-charge technology is a  
patented Molex process, which provides optimized PCB  
adhesion and immense mechanical retention force.  
The SEARAY connector provides numerous benefits.  
It allows customers to simplify PCB routing without  
sacrificing performance. Customers will avoid the  
expense of large, complex, multi-layer boards and  
utilize space better within a given card slot area.  
Option cards may be added or upgraded to increase  
flexibility in design, production and testing. The  
SEARAY connector design has superior electrical and  
mechanical features that are cost competitive. For  
additional information, please visit: www.molex.com/  
product/searay.html.  
SEARAY mezzanine solutions pack many high-speed signals  
in very dense spaces with stack heights of 7.00 to 15.00mm  
(.276 to .591”)  
Features and Benefits  
n Molex’s unique and patented, solder- attach method n Popular footprint is compatible with other products  
is more cost effective and reliable than BGA attach  
methods  
in the market: 1.27 by 1.27mm (.050 by .050”);  
and allows ease in multiple sourcing with other  
common products  
n Data rates of up to 10Gbps have excellent  
signal clarity and large bandwidth for customer  
requirements in high-speed designs  
n Robust contact design prevents stubbing and  
damage in mating interface  
n Flexible tooling design with multiple stack heights  
and circuit sizes provides ease in tooling a new  
circuit size or stack-height version  
SPECIFICATIONS  
Reference Information  
Product Specification: PS-45970-001  
Packaging: Tray  
UL File No.: TBD  
CSA File No.: TBD  
Mechanical  
Mating Force: 50g max. per contact  
Un-mating Force: 30g max. per contact  
Normal Force: 82g max. per contact  
Durability: 100 cycles  
Designed in: Inches  
Physical  
Electrical  
Voltage: 250V AC per contact  
Current: 1.0A per contact  
Housing: Glass-filled LCP, UL 94V-0  
Contact: Copper (Cu) Alloy  
Plating:  
Contact Resistance: 25 milliohms nominal  
Dielectric Withstanding Voltage: 500V DC  
Insulation Resistance: 5000 Megohms min.  
Contact Area – 0.75µm Gold (Au) min.  
Solder Tail Area – 3.80µm Tin (Sn) min.  
Underplating – 1.25µm Nickel (Ni) min. overall  
Operating Temperature: -55 to +105°C  
*SEARAY is a trademark of Samtec, Inc.  
12

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