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45280-2403 PDF预览

45280-2403

更新时间： 2024-11-14 06:28:11
品牌 Logo 应用领域
莫仕 - MOLEX 连接器电源连接器PC
页数 文件大小 规格书
2页 252K
描述
3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers

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45280-2403 技术参数

是否Rohs认证：符合生命周期：Obsolete
Reach Compliance Code：unknown风险等级：5.78
Is Samacsys：N其他特性：POLARIZED
板上安装选件：PEG主体宽度：0.469 inch
主体深度：0.457 inch主体长度：1.693 inch
主体/外壳类型：RECEPTACLE连接器类型：RECTANGULAR POWER CONNECTOR
联系完成配合：GOLD (30)触点性别：MALE
触点材料：NOT SPECIFIED触点模式：RECTANGULAR
触点电阻：10 m Ω触点样式：SQ PIN-SKT
DIN 符合性：NO介电耐压：1500VAC V
耐用性：30 Cycles空壳：NO
滤波功能：NOIEC 符合性：NO
最大插入力：8.0064 N绝缘电阻：1000000000 Ω
绝缘体颜色：BLACK绝缘体材料：GLASS FILLED NYLON
MIL 符合性：NO插接触点节距：0.118 inch
匹配触点行间距：0.118 inch混合触点：NO
安装选项1：GUIDE SLOT安装选项2：LOCKING
安装方式：STRAIGHT安装类型：BOARD
连接器数：ONEPCB行数：2
装载的行数：2最高工作温度：105 °C
最低工作温度：-40 °C选件：GENERAL PURPOSE
PCB接触模式：RECTANGULARPCB触点行间距：2.9972 mm
电镀厚度：30u inch极化密钥：POLARIZED HOUSING
额定电流（信号）：5 A参考标准：UL,CSA,TUV
可靠性：COMMERCIAL外壳材料：POLYMER
子类别：Headers and Edge Type Connectors端子长度：0.189 inch
端子节距：2.9972 mm端接类型：PRESS FIT
触点总数：24UL 易燃性代码：94V-0
撤离力-最小值：3.614 NBase Number Matches：1

45280-2403 数据手册

 浏览型号45280-2403的Datasheet PDF文件第2页 
3.00mm (.118”) Pitch  
Micro-Fit 3.0, CPI™  
Micro-Fit 3.0, BMI™ CPI  
Vertical Headers  
FEATURES AND SPECIFICATIONS  
Micro-Fit 3.0 Family Offers Press-Fit Headers For High-Density  
Power and Signal Applications  
The Micro-Fit 3.0, CPI (Compliant Pin Interface) and Micro-Fit 3.0, BMI CPI  
(Blind-Mate version with Compliant Pin Interface) are vertical header product  
extensions featuring press-fit PC tails. These headers are designed for high-  
density applications where press-fit terminations are required. The CPI products  
are appropriate for both power and signal uses as they can carry up to 5.0A of  
current per circuit.  
The standard Micro-Fit 3.0, CPI headers incorporate a compact housing that  
mates with standard wire-mount housings and crimp terminals for wire-to-board  
applications.  
The Micro-Fit 3.0, BMI CPI headers feature a funnel entry to guide the mating  
receptacle into place. Micro-Fit 3.0, BMI headers mate exclusively with BMI  
components, which include panel-mount receptacles with crimp terminals and  
PCB receptacles for wire-to-board and board-to-board applications.  
Features and Benefits  
■ CPI style (press-fit) pins require no soldering to the PCB  
■ Designed for multiple board thicknesses of 2.36mm (.093”) or greater  
■ Dual-row vertical headers available in 2-24 circuits for the standard version  
and 4-24 circuits for the BMI (blind-mate) version  
■ Rated up to 5.0A of current for both power and signal applications in wire-to-  
board and board-to-board configurations  
■ Fully polarized with positive locks for proper mating  
■ Fully isolated contacts for electrical and mechanical integrity  
Reference Information  
Packaging:Tray  
UL File No.: E29179  
CSA File No.: LR19980  
TUV No.: R95107  
Mechanical  
Insertion Force to PCB: 35.6N (8.0lb) per circuit max.  
Retention Force to PCB: 106.8N (24.0lb) per circuit min.  
Mating Force: 8.0N (1.8lb) per circuit max.  
Unmating Force: 3.6N (0.8lb) per circuit min.  
Durability: 30 cycles  
Designed In: Millimeters  
Electrical  
Physical  
Voltage: 250V  
Housing: High-temperature polymer, UL 94V-0  
Contact: Brass alloy  
Current: 5.0A  
Contact Resistance: 10 milliohms max.  
Dielectric Withstanding Voltage: 1500 VAC  
Insulation Resistance: 1000 Megohms min.  
Plating:  
Contact area – 5.1µm (200µ") min. Tin, 0.38µm (15µ”)  
min. select Gold or 0.76µm (30µ”) min. select Gold  
PC tails – Tin/Lead  
Underplating: Nickel  
PCB Thickness: 2.36mm (.093”) min.  
Operating Temperature: -40 to +105° C  
12

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