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45280-1801 PDF预览

45280-1801

更新时间: 2024-01-11 02:21:48
品牌 Logo 应用领域
莫仕 - MOLEX 连接器电源连接器PC
页数 文件大小 规格书
2页 252K
描述
3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers

45280-1801 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:compliant
风险等级:5.78Is Samacsys:N
其他特性:POLARIZED板上安装选件:HOLE .055-.063
主体宽度:0.469 inch主体深度:0.457 inch
主体长度:1.338 inch主体/外壳类型:RECEPTACLE
连接器类型:RECTANGULAR POWER CONNECTOR联系完成配合:TIN (200)
联系完成终止:TIN (200)触点性别:MALE
触点材料:NOT SPECIFIED触点模式:RECTANGULAR
触点样式:SQ PIN-SKTDIN 符合性:NO
空壳:NO滤波功能:NO
IEC 符合性:NO最大插入力:8.0064 N
绝缘体颜色:BLACK绝缘体材料:GLASS FILLED NYLON
JESD-609代码:e3MIL 符合性:NO
插接触点节距:0.118 inch匹配触点行间距:0.118 inch
混合触点:NO安装选项1:LOCKING
安装方式:STRAIGHT安装类型:BOARD
连接器数:ONEPCB行数:2
装载的行数:2选件:GENERAL PURPOSE
PCB接触模式:RECTANGULARPCB触点行间距:2.9972 mm
电镀厚度:200u inch参考标准:UL
可靠性:COMMERCIAL外壳材料:POLYMER
子类别:Headers and Edge Type Connectors端子长度:0.19 inch
端子节距:2.9972 mm端接类型:PRESS FIT
触点总数:18UL 易燃性代码:94V-0
Base Number Matches:1

45280-1801 数据手册

 浏览型号45280-1801的Datasheet PDF文件第2页 
3.00mm (.118”) Pitch  
Micro-Fit 3.0, CPI™  
Micro-Fit 3.0, BMI™ CPI  
Vertical Headers  
FEATURES AND SPECIFICATIONS  
Micro-Fit 3.0 Family Offers Press-Fit Headers For High-Density  
Power and Signal Applications  
The Micro-Fit 3.0, CPI (Compliant Pin Interface) and Micro-Fit 3.0, BMI CPI  
(Blind-Mate version with Compliant Pin Interface) are vertical header product  
extensions featuring press-fit PC tails. These headers are designed for high-  
density applications where press-fit terminations are required. The CPI products  
are appropriate for both power and signal uses as they can carry up to 5.0A of  
current per circuit.  
The standard Micro-Fit 3.0, CPI headers incorporate a compact housing that  
mates with standard wire-mount housings and crimp terminals for wire-to-board  
applications.  
The Micro-Fit 3.0, BMI CPI headers feature a funnel entry to guide the mating  
receptacle into place. Micro-Fit 3.0, BMI headers mate exclusively with BMI  
components, which include panel-mount receptacles with crimp terminals and  
PCB receptacles for wire-to-board and board-to-board applications.  
Features and Benefits  
CPI style (press-fit) pins require no soldering to the PCB  
Designed for multiple board thicknesses of 2.36mm (.093”) or greater  
Dual-row vertical headers available in 2-24 circuits for the standard version  
and 4-24 circuits for the BMI (blind-mate) version  
Rated up to 5.0A of current for both power and signal applications in wire-to-  
board and board-to-board configurations  
Fully polarized with positive locks for proper mating  
Fully isolated contacts for electrical and mechanical integrity  
Reference Information  
Packaging:Tray  
UL File No.: E29179  
CSA File No.: LR19980  
TUV No.: R95107  
Mechanical  
Insertion Force to PCB: 35.6N (8.0lb) per circuit max.  
Retention Force to PCB: 106.8N (24.0lb) per circuit min.  
Mating Force: 8.0N (1.8lb) per circuit max.  
Unmating Force: 3.6N (0.8lb) per circuit min.  
Durability: 30 cycles  
Designed In: Millimeters  
Electrical  
Physical  
Voltage: 250V  
Housing: High-temperature polymer, UL 94V-0  
Contact: Brass alloy  
Current: 5.0A  
Contact Resistance: 10 milliohms max.  
Dielectric Withstanding Voltage: 1500 VAC  
Insulation Resistance: 1000 Megohms min.  
Plating:  
Contact area – 5.1µm (200µ") min. Tin, 0.38µm (15µ”)  
min. select Gold or 0.76µm (30µ”) min. select Gold  
PC tails – Tin/Lead  
Underplating: Nickel  
PCB Thickness: 2.36mm (.093”) min.  
Operating Temperature: -40 to +105° C  

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