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4310S-102-2702BCDL PDF预览

4310S-102-2702BCDL

更新时间: 2024-11-12 06:01:19
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
2页 198K
描述
Array/Network Resistor, Isolated, Thin Film, 0.2W, 27000ohm, 50V, 0.1% +/-Tol, -25,25ppm/Cel, 9808,

4310S-102-2702BCDL 数据手册

 浏览型号4310S-102-2702BCDL的Datasheet PDF文件第2页 
Features  
Custom circuits available per factory  
RoHS compliant* (see How to Order  
“Termination” option)  
Low profile provides compatibility with  
DIPs  
Also available in medium profile (4300S -  
.250 ”) and high profile (4300K - .350 ”)  
Marking on contrasting background  
4300T, S, K Series - Thin Film Molded SIP  
Product Characteristics  
Package Power Temp. Derating Curve  
Product Dimensions  
27.53  
Resistance Range  
(Low Profile% 4300T)  
MAX.  
(1.084)  
24.99  
Bussed ...................49.9 to 100K ohms  
Isolated......................20 to 200K ohms  
Series.........................20 to 100K ohms  
Resistance Tolerance  
......................... 0.1 ꢀ% 0.ꢁ ꢀ% 1 ꢀ  
Temperature Coefficient  
MAX.  
(.984)  
19.92  
(.784)  
PIN #1 REF.  
22.45  
(.884)  
14.83  
(.584)  
MAX.  
MAX.  
4.95  
(.195)  
MAX.  
MAX.  
1.75  
1.50  
4311T  
.................. 100 ppmꢂ/C% ꢁ0 ppmꢂ/C%  
2ꢁ ppmꢂ/C  
Temperature Range ....-ꢁꢁ /C to +12ꢁ /C  
Insulation Resistance  
..................10%000 megohms minimum  
TCR Tracking ......................... ꢁ ppmꢂ/C  
Maximum Operating Voltage............ꢁ0 V  
1.25  
1.00  
.75  
4310T  
4309T  
.381 + .127/ - .000  
(.015 + .005/ - 000)  
3.43 + .38/ - .25  
(.135 + .015/ - .010)  
1.02 ± .12  
4308T  
(.040 ± .005)  
.483 ± .050  
(.020 ± .002)  
4306T  
TYP.  
2.54 ± .07  
.50  
(.100 ± .003*)  
TYP.  
Environmental Characteristics  
NON-ACCUM.  
.25  
2.16 ± .10  
(.085 ± .004)  
Thermal Shock and  
Power Conditioning ...................... 0.1 ꢀ  
Short Time Overload..................... 0.1 ꢀ  
Terminal Strength........................ 0.2ꢁ ꢀ  
Resistance to Soldering Heat ....... 0.1 ꢀ  
Moisture Resistance ..................... 0.1 ꢀ  
Life .............................................. 0.ꢁ0 ꢀ  
0
25  
70  
125  
150  
°
AMBIENT TEMPERATURE ( C )  
1.02 ± .05  
(.0425 ± .002)  
Package Power Ratings at 70°C  
.254 ± .050  
(.010 ± .002)  
T
S
K
Physical Characteristics  
4304 .......... ............ 0.60...... 0.80 watts  
4306 ...... 0.7ꢁ.......... 0.90...... 1.20 watts  
4308 ...... 1.00.......... 1.20...... 1.60 watts  
4309 ...... 1.13 ................................watts  
4310 ...... 1.2ꢁ.......... 1.ꢁ0...... 2.00 watts  
4311 ...... 1.38 ................................watts  
Body Material Flammability  
...........................Conforms to UL94V-0  
Lead Frame Material  
..........................Copper% solder coated  
Body Material ..................Novolac epoxy  
Governing dimensions are in metric. Dimensions in parentheses  
are inches and are approximate.  
*Terminal centerline to centerline measurements made at point of  
emergence of the lead from the body.  
How To Order  
Typical Part Marking  
43 11 T - 101 - 2222 F A B __  
Model  
Represents total content. Layout may vary.  
(43 = Molded SIP)  
CIRCUIT  
RESISTANCE  
CODE  
PART  
NUMBER  
Number of Pins  
4311T-101-  
1003BB  
Physical Config.  
YYWW  
•T = Low Profile Thin Film  
•S = Med. Profile Thin Film  
•K = High Profile Thin Film  
DATE CODE  
PIN ONE  
INDICATOR  
MANUFACTURER'S  
TRADEMARK  
Electrical Configuration  
•101 = Bussed  
•102 = Isolated  
•106 = Series  
Resistance Code  
•First 3 digits are significant  
•Fourth digit represents the  
number of zeros to follow.  
Absolute Tolerance Code  
•B = 0.1ꢀ  
•D = 0.ꢁꢀ  
•F = 1ꢀ  
Temperature Coefficient Code  
•A = 100ppmꢂ/C •C = 2ꢁppmꢂ/C  
•B = ꢁ0ppmꢂ/C  
Ratio Tolerance (Optional)  
•A = 0.0ꢁꢀ to R1 •D = 0.ꢁꢀ to R1  
•B = 0.1ꢀ to R1  
Terminations  
• L = Tin-plated (RoHS compliant version)  
• Blank = TinꢂLead-plated  
Consult factory for other available options.  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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