Datasheet > 3SMBJ5914B-TPX01

3SMBJ5914B-TPX01

更新时间： 2024-01-28 05:41:24

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
4页	362K
描述
Zener Diode,

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中文翻译

获取价格

技术参数
数据手册

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3SMBJ5914B-TPX01 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	unknown	风险等级：	5.79
Base Number Matches：	1

3SMBJ5914B-TPX01 数据手册

3SMBJ5913B-TPX01

THRU

3SMBJ5943B-TPX01

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

3.0 Watt

Surface Mount

Silicon

Lead Free Finish/RoHS Compliant (Note1) ("P" Suffix designates

RoHS Compliant. See ordering information)

ꢀ

3.3thru 56 Volt Voltage Range

Low Inductance,Low Profile Mounting

Glass Passivated Junction

Zener Diodes

Available on Tape and Reel

Mechanical Data

DO-214AA

(SMB) (LEAD FRAME)

ꢀ

Epoxy meets UL 94 V-0 flammability rating

Moisure Sensitivity Level 1

Terminals solderable per MIL-STD-750, Method 2026

Polarity is indicated by cathode band.

Packaging: Standard 12mm Tape (see EIA 481)

Maximum temperature for soldering: 260⁰C for 10 seconds.

Maximum Ratings @ 25^oC Unless Otherwise Specified

Maximum

V_F

P_d

1.5V

(Note: 2)

(Note: 3)

Forward

Voltage

Steady State

3.0W

Power

Dissipation

Operation and

Storage

Temperature

T_J, T_STG-55^oC to

+150 ^oC

DIMENSIONS

INCHES

DIM

MIN

MAX

.185

.155

.012

.060

.220

.096

.087

.008

MIN

4.06

3.30

0.15

0.76

5.08

2.00

1.91

0.05

MAX

4.70

3.94

0.31

1..52

5.59

2.44

2.21

0.203

NOTE

.160

.130

.006

.030

.200

.079

.075

.002

Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

SUGGESTED SOLDER

PAD LAYOUT

Forward Current @ 200mA.

0.106"

Mounted on 5.0mm²(1oz thick) Iand areas.

Lead temperature at T_L=75^oC

0.083”

0.050”

www.mccsemi.com

Revision: A

2011/01/01

1 of 4

12 3 4

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