Datasheet > 3SMBJ5918B_18

3SMBJ5918B_18

更新时间： 2024-09-29 00:49:23

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
4页	347K
描述
3.0 Watt Surface Mount Silicon Zener Diodes

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中文翻译

获取价格

数据手册

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3SMBJ5918B_18 数据手册

M C C

3SMBJ5918B

THRU

3SMBJ5956B

Micro Commercial Components

20736 Marilla Street Chatsworth

CA 91311

Phone:(818) 701-4933

Fax: (818) 701-4939

Features

3.0 Watt

Surface Mount

Silicon

•

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

5.1 thru 200 Volt Voltage Range

Low Inductance, Low Profile Mounting

Glasss Passivated Junction

•

Available On Tape and Reel

Zener Diodes

•

Halogen free available upon request by adding suffix "-HF"

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

DO-214AA

(SMB) (LEAD FRAME)

Mechanical Data

ꢀ

Terminals solderable per MIL-STD-750, Method 2026

ꢀ

Polarity is indicated by cathode band.

Packaging: Standard 12mm Tape (see EIA 481)

Maximum temperature for soldering: 260⁰C for 10 seconds.

Maximum Ratings @ 25^oC Unless Otherwise Specified

Maximum

V_F

P_d

1.5V

(Note: 2)

(Note: 3)

Forward

Voltage

Steady State

3.0W

Power

Dissipation

-65^oC to

DIMENSIONS

Operation and

Storage

Temperature

T_J, T_STG

+150 ^oC

INCHES

MIN

DIM

MAX

.185

.155

.012

.060

.220

.096

.087

.008

MAX

4.70

3.94

0.31

1..52

5.59

2.44

2.21

0.203

NOTE

.160

.130

.006

.030

.200

.079

.075

.002

4.06

3.30

0.15

0.76

5.08

2.00

1.91

0.05

42^oC /W

Thermal Resistance R

Junction to

Ambient

thJA

Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

SUGGESTED SOLDER

PAD LAYOUT

Forward Current @ 200mA.

0.106"

Mounted on 5.0mm²(1oz thick) Iand areas.

Lead temperature at T_L=75^oC

0.083”

0.050”

www.mccsemi.com

Revision:A

2018/01/01

1 of 4

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