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39-27-3642 PDF预览

39-27-3642

更新时间： 2024-11-02 05:58:59
品牌 Logo 应用领域
莫仕 - MOLEX /
页数 文件大小 规格书
3页 256K
描述
Board Connector, 64 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal

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中文翻译

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39-27-3642 数据手册

 浏览型号39-27-3642的Datasheet PDF文件第2页浏览型号39-27-3642的Datasheet PDF文件第3页 
            
2.54mm (.100") Pitch  
QF 50™  
FEATURES AND SPECIFICATIONS  
Features and Benefits  
  10 to 64 circuits  
  Tin plated on solder tail  
  Complies with industry standard DIN 41654  
  Polarized  
  Selective Gold plating options for contacts  
  Eject levers allow end-to-end stacking with or without strain  
relief with no loss of board space  
Electrical  
Voltage: 250V  
Shrouded Header  
Current: 1.0A  
Contact Resistance: 20mΩ max.  
Dielectric Withstanding Voltage: 500V  
Insulation Resistance: 1000 MΩ min.  
5578  
Right Angle  
With Eject Levers  
Physical  
Housing: Glass-filled PBTP  
Contact: Brass  
Reference Information  
Packaging: Tray  
Operating Temperature: -40 to +105˚C  
Mates With: 5320  
Designed In: Millimeters  
H
CATALOG DRAWING (FOR REFERENCE ONLY)  
ORDERING INFORMATION AND DIMENSIONS  
Order No.  
Dimension  
Circuits  
Plating NBGS1  
39-27-1106  
39-27-1146  
39-27-1166  
39-27-1206  
39-27-1266  
39-27-1306  
39-27-1346  
39-27-1406  
39-27-1506  
39-27-1606  
39-27-1646  
Plating NBGS2  
39-27-1107  
39-27-1147  
39-27-1167  
39-27-1207  
39-27-1267  
39-27-1307  
39-27-1347  
39-27-1407  
39-27-1507  
39-27-1607  
39-27-1647  
Plating NBT2  
39-28-5106  
39-28-5146  
39-28-5166  
39-28-5206  
39-28-5266  
39-28-5306  
39-28-5346  
39-28-5406  
39-28-5506  
A
B
C
D
E
10  
14  
16  
20  
26  
30  
34  
40  
50  
60  
64  
32.16 (1.266)  
37.24 (1.466)  
39.78 (1.566)  
44.86 (1.766)  
52.48 (2.066)  
57.56 (2.266)  
62.64 (2.466)  
70.26 (2.766)  
82.96 (3.266)  
95.66 (3.766)  
100.74 (3.966)  
10.16 (.400)  
15.24 (.600)  
17.78 (.700)  
22.86 (.900)  
30.48 (1.200)  
35.56 (1.400)  
40.64 (1.600)  
48.26 (1.900)  
60.96 (2.400)  
73.66 (2.900)  
78.74 (3.100)  
28.04 (1.104)  
33.12 (1.304)  
35.66 (1.404)  
40.74 (1.604)  
48.36 (1.904)  
53.44 (2.104)  
58.52 (2.304)  
66.14 (2.604)  
78.84 (3.104)  
91.54 (3.604)  
96.62 (3.804)  
21.94 (.864)  
27.02 (1.064)  
29.56 (1.164)  
34.64 (1.364)  
42.26 (1.664)  
47.34 (1.864)  
52.42 (2.064)  
60.04 (2.364)  
72.74 (2.864)  
85.44 (3.364)  
90.52 (3.564)  
17.76 (.700)  
22.84 (.900)  
25.38 (1.000)  
30.46 (1.200)  
38.08 (1.500)  
43.16 (1.700)  
48.24 (1.900)  
55.86 (2.200)  
68.56 (2.700)  
81.26 (3.200)  
86.34 (3.400)  
Plating NBGS1: 39µ" (1µm) min. Nickel underplate. Contact area: 0.1µm min. Gold.  
Solder area: 3µm min. Tin/Lead.  
Plating NBGS2: 39µ" (1µm) min. Nickel underplate. Contact area: 0.76µm min. Gold.  
Solder area: 3µm min. Tin/Lead.  
Plating NBT2: 20µ" (0.5µm) min. Nickel underplate. Contact and solder area: 39µ" (1µm) min. Tin.  
H-24  
MX01  
123

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