MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DPAK
CASE 369A–13
ISSUE AB
DATE 07/27/2001
SCALE 1:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
C
B
R
INCHES
DIM MIN MAX
MILLIMETERS
E
V
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
0.235
0.250
0.086
0.027
0.033
0.037
0.250
0.265
0.094
0.035
0.040
0.047
4
2
Z
A
K
S
1
3
G
H
J
0.180 BSC
4.58 BSC
U
0.034
0.018
0.102
0.040
0.023
0.114
0.87
0.46
2.60
1.01
0.58
2.89
K
L
0.090 BSC
2.29 BSC
F
J
R
S
U
V
Z
0.175
0.020
0.020
0.030
0.138
0.215
0.050
---
4.45
0.51
0.51
0.77
3.51
5.46
1.27
---
L
H
0.050
---
1.27
---
D 2 PL
M
G
0.13 (0.005)
T
MARKING
DIAGRAMS
Integrated
Circuits
Discrete
STYLE 1:
PIN 1. BASE
STYLE 2:
PIN 1. GATE
2. DRAIN
STYLE 3:
PIN 1. ANODE
STYLE 4:
PIN 1. CATHODE
2. ANODE
3. GATE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
2. CATHODE
3. ANODE
4. CATHODE
xxxxx
ALYWW
x
3. SOURCE
4. DRAIN
YWW
xxxxxxxx
4. ANODE
STYLE 5:
PIN 1. GATE
STYLE 6:
PIN 1. MT1
STYLE 7:
PIN 1. GATE
2. ANODE
3. CATHODE
4. ANODE
2. MT2
3. GATE
4. MT2
2. COLLECTOR
3. EMITTER
4. COLLECTOR
xxxxxxxxx = Device Code
A
= Assembly Location
lL
Y
= Wafer Lot
= Year
WW
= Work Week
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Semiconductor Components Industries, LLC, 2001
1
Case Outline Number:
August, 2001 – Rev. 13AB
369A