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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 3-794632-6 | MACOM |
获取价格 |
VERTICAL HEADER ASSEMBLY, THRU HOLE, 30 GOLD, DUAL ROW, MICRO MATE-N-LOK |
|
| 3-794632-6 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 3-794632-8 | MACOM |
获取价格 |
VERTICAL HEADER ASSEMBLY, THRU HOLE, 30 GOLD, DUAL ROW, MICRO MATE-N-LOK |
|
| 3-794632-8 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 3-794633-2 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 3-794633-4 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 3-794633-6 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 3-794633-8 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 3-794634-2 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 3-794634-4 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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