2SA2151AP

更新时间： 2024-02-15 07:24:22

品牌	Logo	应用领域
急速微 - ALLEGRO		晶体晶体管功率双极晶体管放大器局域网
页数	文件大小	规格书
7页	279K
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数据手册

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2SA2151AP 数据手册

Audio Amplification Transistor

2SA2151

PACKAGE OUTLINE DRAWING, TO-3P

15.6 ±0.3

14.0 ±0.3

13.6 ±0.2

5.0 MAX

2.1 MAX

9.6 ±0.3

Branding

XXXXXXXX

+0.2

–0.3

1.7

+0.2

–0.1

(2×)

(3×)

+0.2

–0.1

+0.2

–0.1

0.6

+0.2

–0.1

1.0

2×P5.45 ±0.1

Terminal dimension at lead tips

15.8 ±0.2

Pin Assignments:

1. Base

2. Collector

3. Emitter

Terminal core material: Cu

Terminal treatment: Ni plating and solder dip

Heat sink core material: Cu

Branding codes (exact appearance at manufacturer discretion):

1st line, type: A2151

Heat sink treatment: Ni plating

Leadform number: 100

2nd line, lot:

Where: Y is the last digit of the year of manufacture

M is the month (1 to 9, O, N, D)

H is the h_FErating (O, P, or Y; for values see

footnote, Electrical Characteristics table)

Dimensions in millimeters

Leadframe plating Pb-free. Device composition

includes high-temperature solder (Pb >85%),

which is exempted from the RoHS directive.

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

1 2 3 456 7

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