2N4401
General Purpose
Transistors
NPN Silicon
http://onsemi.com
Features
• Pb−Free Packages are Available*
COLLECTOR
3
MAXIMUM RATINGS
2
Rating
Collector − Emitter Voltage
Collector − Base Voltage
Emitter − Base Voltage
Symbol
Value
40
Unit
Vdc
BASE
V
CEO
CBO
1
V
60
Vdc
EMITTER
V
EBO
6.0
Vdc
Collector Current − Continuous
I
C
600
mAdc
Total Device Dissipation
P
D
D
@ T = 25°C
625
5.0
mW
A
Derate above 25°C
mW/°C
TO−92
CASE 29
STYLE 1
Total Device Dissipation
P
@ T = 25°C
1.5
12
W
mW/°C
C
Derate above 25°C
1
1
Operating and Storage Junction
Temperature Range
T , T
−55 to
+150
°C
2
2
J
stg
3
3
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
200
Unit
°C/W
°C/W
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
R
q
JA
MARKING DIAGRAM
R
q
JC
83.3
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
RecommendedOperating Conditions may affect device reliability.
2N
4401
AYWW G
G
2N4401 = Device Code
A
= Assembly Location
Y
= Year
WW
G
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
February, 2010 − Rev. 4
2N4401/D