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2N4401_10 PDF预览

2N4401_10

更新时间: 2022-09-16 12:39:49
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
7页 191K
描述
General Purpose Transistors

2N4401_10 数据手册

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2N4401  
General Purpose  
Transistors  
NPN Silicon  
http://onsemi.com  
Features  
PbFree Packages are Available*  
COLLECTOR  
3
MAXIMUM RATINGS  
2
Rating  
Collector Emitter Voltage  
Collector Base Voltage  
Emitter Base Voltage  
Symbol  
Value  
40  
Unit  
Vdc  
BASE  
V
CEO  
CBO  
1
V
60  
Vdc  
EMITTER  
V
EBO  
6.0  
Vdc  
Collector Current Continuous  
I
C
600  
mAdc  
Total Device Dissipation  
P
D
D
@ T = 25°C  
625  
5.0  
mW  
A
Derate above 25°C  
mW/°C  
TO92  
CASE 29  
STYLE 1  
Total Device Dissipation  
P
@ T = 25°C  
1.5  
12  
W
mW/°C  
C
Derate above 25°C  
1
1
Operating and Storage Junction  
Temperature Range  
T , T  
55 to  
+150  
°C  
2
2
J
stg  
3
3
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
200  
Unit  
°C/W  
°C/W  
Thermal Resistance, JunctiontoAmbient  
Thermal Resistance, JunctiontoCase  
R
q
JA  
MARKING DIAGRAM  
R
q
JC  
83.3  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
RecommendedOperating Conditions may affect device reliability.  
2N  
4401  
AYWW G  
G
2N4401 = Device Code  
A
= Assembly Location  
Y
= Year  
WW  
G
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference  
Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
February, 2010 Rev. 4  
2N4401/D  

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