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2DAC-C16R PDF预览

2DAC-C16R

更新时间: 2024-11-09 02:56:39
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 236K
描述
Integrated Passive & Active Device using CSP

2DAC-C16R 数据手册

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Features  
Lead free versions available  
RoHS compliant (lead free version)*  
New Product Development  
Integrated Passive Device  
ESD Protection to IEC61000-4-2 Spec.  
2DAC-C16R Series - Integrated Passive & Active Device using CSP  
General Information  
This application specific integrated passive component is  
designed to provide all of the necessary ESD protection  
on the data port of a portable electronic device. The ESD  
protection provided by the component enables the data  
port to withstand 8 ꢀV Contact ꢁ 15 ꢀV Air Discharge  
when tested according to the method specified in IEC  
61000-4-2. The component incorporates 12 identical ports  
and is supplied in a 16 pin CSP package which is intended  
to be mounted directly onto an FR4 printed circuit board.  
This package is designed to meet typical thermal cycle  
and bend test specifications without the use of an  
underfill material.  
SOLDER  
BUMPS  
SILICON  
DIE  
Figure 1 – CSP Format  
Electrical & Thermal Characteristics  
Electrical Characteristics  
Symbol  
Minimum  
Nominal  
Maximum  
Unit  
(TA = 25 °C unless otherwise noted)  
Zener Diode  
Breakdown Voltage @ 1 mA  
Leakage Current @ 3 V  
Diode Capacitance @ 1 V & 1 MHz  
VBR  
IR  
CT  
6
7.2  
8
1
12.5  
V
uA  
pF  
8.5  
10.5  
ESD Performance (Note 1 & 2)  
Withstand  
Contact Discharge  
Air Discharge  
8
15  
kV  
kV  
Let Through  
Contact Discharge  
Air Discharge  
150  
150  
V
V
Thermal Characteristics  
(TA = 25 °C unless otherwise noted)  
Operating Temperature  
Storage Temperature  
Total Power Dissipation @ 70 °C  
TJ  
Tstg  
PD  
-40  
-60  
25  
25  
+85  
+125  
100  
°C  
°C  
mW  
Note: 1. The IEC 61000-4-2 test method will be adapted for component level testing. The device will provide the specified ESD protection  
performance on the “EXT1 – 12” pins only.  
2. “Let Through” is a measure of the component of an incident ESD transient that the protection device allows through to the down  
stream circuitry.  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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