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24LC256-I/SMRVA PDF预览

24LC256-I/SMRVA

更新时间: 2024-11-13 20:09:51
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
42页 1230K
描述
32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8

24LC256-I/SMRVA 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP, SOP8,.3针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.26
最大时钟频率 (fCLK):0.4 MHz数据保留时间-最小值:200
耐久性:1000000 Write/Erase CyclesI2C控制字节:1010DDDR
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
长度:5.26 mm内存密度:262144 bit
内存集成电路类型:EEPROM内存宽度:8
功能数量:1端子数量:8
字数:32768 words字数代码:32000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:32KX8
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.3封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:SERIAL
峰值回流温度(摄氏度):260认证状态:Not Qualified
反向引出线:NO座面最大高度:2.03 mm
串行总线类型:I2C最大待机电流:0.000001 A
最大压摆率:0.003 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:5.25 mm
最长写入周期时间 (tWC):5 ms写保护:HARDWARE
Base Number Matches:1

24LC256-I/SMRVA 数据手册

 浏览型号24LC256-I/SMRVA的Datasheet PDF文件第2页浏览型号24LC256-I/SMRVA的Datasheet PDF文件第3页浏览型号24LC256-I/SMRVA的Datasheet PDF文件第4页浏览型号24LC256-I/SMRVA的Datasheet PDF文件第5页浏览型号24LC256-I/SMRVA的Datasheet PDF文件第6页浏览型号24LC256-I/SMRVA的Datasheet PDF文件第7页 
24AA256/24LC256/24FC256  
256K I2C™ CMOS Serial EEPROM  
Temperature Ranges:  
Device Selection Table  
- Industrial (I):  
- Automotive (E):  
-40C to +85C  
-40C to +125C  
Part  
VCC  
Max. Clock  
Frequency  
Temp.  
Ranges  
Number  
Range  
Description:  
24AA256  
24LC256  
24FC256  
1.7-5.5V  
2.5-5.5V  
1.7-5.5V  
400 kHz(1)  
400 kHz  
1 MHz(2)  
I, E  
I, E  
I
The Microchip Technology Inc. 24AA256/24LC256/  
24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial  
Electrically Erasable PROM, capable of operation  
across a broad voltage range (1.7V to 5.5V). It has  
been developed for advanced, low-power applications  
such as personal communications or data acquisition.  
This device also has a page write capability of up to 64  
bytes of data. This device is capable of both random  
and sequential reads up to the 256K boundary.  
Functional address lines allow up to eight devices on  
the same bus, for up to 2 Mbit address space. This  
device is available in the standard 8-pin plastic DIP,  
SOIC, SOIJ, TSSOP, MSOP, DFN and TDFN pack-  
ages. The 24AA256 is also available in the 8-lead Chip  
Scale package.  
Note 1: 100 kHz for VCC < 2.5V.  
2: 400 kHz for VCC < 2.5V.  
Features:  
• Single Supply with Operation Down to 1.7V for  
24AA256 and 24FC256 Devices, 2.5V for  
24LC256 Devices  
• Low-Power CMOS Technology:  
- Read current: 400 uA max. at 5.5V, 400 kHz  
- Standby current: 1 uA max. at 3.6V, I-temp  
• 2-Wire Serial Interface, I2CCompatible  
• Cascadable up to Eight Devices  
• Schmitt Trigger Inputs for Noise Suppression  
• Output Slope Control to Eliminate Ground Bounce  
• 100 kHz and 400 kHz Clock Compatibility  
• Page Write Time 5 ms Max.  
Block Diagram  
A0 A1A2WP  
HV Generator  
I/O  
Control  
Logic  
• Self-Timed Erase/Write Cycle  
Memory  
Control  
Logic  
EEPROM  
Array  
XDEC  
• 64-Byte Page Write Buffer  
• Hardware Write-Protect  
Page Latches  
• ESD Protection >4000V  
I/O  
• More than One Million Erase/Write Cycles  
• Data Retention >200 years  
SCL  
YDEC  
SDA  
• Factory Programming Available  
• Packages Include 8-lead PDIP, SOIC, SOIJ, DFN,  
TDFN, TSSOP and MSOP  
VCC  
Sense Amp.  
R/W Control  
VSS  
• RoHS Compliant  
Package Types  
TSSOP/MSOP(1)  
DFN/TDFN  
CS (Chip Scale)(2)  
VCC A1 A0  
PDIP/SOIC/SOIJ  
A0  
1
8
VCC  
1
2
3
4
A0  
A1  
8
7
6
5
VCC  
WP  
1
2
8
7
A0  
A1  
VCC  
WP  
1
2
3
A1  
A2  
2
3
4
7
6
5
WP  
4
5
WP  
A2  
A2  
SCL  
SDA  
8
6
7
SCL  
SDA  
3
4
6
5
A2  
SCL  
SDA  
SDA SCL VSS  
VSS  
VSS  
VSS  
(TOP DOWN VIEW,  
BALLS NOT VISIBLE)  
Note 1: * Pins A0 and A1 are no connects for the MSOP package only.  
Note 2: Available in I-temp, “AA” only.  
*24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices.  
1998-2013 Microchip Technology Inc.  
DS20001203U-page 1  

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