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24IMS7-15-9C2 PDF预览

24IMS7-15-9C2

更新时间: 2024-10-28 14:46:15
品牌 Logo 应用领域
BEL 局域网
页数 文件大小 规格书
16页 280K
描述
DC-DC Regulated Power Supply Module, 1 Output, 7.2W, Hybrid,

24IMS7-15-9C2 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.8模拟集成电路 - 其他类型:DC-DC REGULATED POWER SUPPLY MODULE
最大输入电压:36 V最小输入电压:14 V
标称输入电压:24 VJESD-30 代码:R-XBFM-P9
JESD-609代码:e0最大负载调整率:1%
功能数量:1输出次数:1
端子数量:9最高工作温度:71 °C
最低工作温度:-40 °C最大输出电压:15.75 V
最小输出电压:11.25 V标称输出电压:15 V
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified表面贴装:NO
技术:HYBRID温度等级:OTHER
端子面层:TIN LEAD端子形式:PIN/PEG
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
最大总功率输出:7.2 W微调/可调输出:YES
Base Number Matches:1

24IMS7-15-9C2 数据手册

 浏览型号24IMS7-15-9C2的Datasheet PDF文件第10页浏览型号24IMS7-15-9C2的Datasheet PDF文件第11页浏览型号24IMS7-15-9C2的Datasheet PDF文件第12页浏览型号24IMS7-15-9C2的Datasheet PDF文件第13页浏览型号24IMS7-15-9C2的Datasheet PDF文件第14页浏览型号24IMS7-15-9C2的Datasheet PDF文件第15页 
Board Mountable  
DC-DC Converters  
IMS 7 Series  
Description of Options  
Table 17: Survey of options  
Function  
Option  
SMD version with pins  
SMD version with PCB lid  
Open frame version  
C-pinout  
M
L
Z
C
Option C  
09119  
4
The C-pinout configures the electrically isolated double out-  
puts to the "industrial pinout" Vo1+, Vo2with common  
ground Go. With the C-pinout the converter height is in-  
creased by the adapter PCB (see also: Mechanical Data).  
Top view  
50  
Option M and L  
Surface mount version  
Note: Precautions should be taken when reflow soldering  
the SMD version. The reflow soldering instructions below  
should be strictly adhered to. An inadequate soldering proc-  
ess may permanently damage the converter or degrade its  
performance and Power-One will not honour any guaran-  
tee/warranty claims resulting from damage caused by ig-  
noring the soldering instructions.  
Fig. 29  
Proposed solder lands option M  
3.6 (1.4")  
Foot print  
Infrared soldering is not permitted.  
The surface mountable version of this product is assem-  
bled with high melting point solder (227°C) to ensure that  
the solder joints of of the internal components do not de-  
grade in the end users SMD soldering process.  
8 x 5 (1.9")  
This product is only specified for "Forced Convection  
Reflow Soldering" (Hot Air). Any conventional soldering  
profile is acceptable provided that the restriction curve be-  
low is not exceeded at any time during the reflow process.  
Fig. 30  
Proposed solder lands option L  
Tpeak [°C]  
11051  
240  
235  
230  
225  
220  
215  
210  
t [s]  
205  
50  
0
20  
30  
40  
10  
Fig. 28  
Forced convection reflow soldering restriction curve  
measured on pin 2  
Accessories  
Mounting supports for chassis and DIN-rail mounting.  
Edition 6/4.2000  
16/16  

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